SCOPUS 정보 검색 플랫폼

2006 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2006, Pages 193-196

Reversible wafer bonding; Challenges in ramping up 150mm GaAs wafer production to meet growing demand

(3) Combe, Suzanne a Cullen, John a O'Keefe, Matthew a

Author keywords

150mm GaAs wafer; Backend process; Cycle time reduction; Process capability; Yield

Indexed keywords

CYCLE TIME REDUCTION; FILTRONIC COMPOUND SEMICONDUCTORS; GAAS WAFER; PROCESS CAPABILITIES; PROCESS DEVELOPMENT; SAPPHIRE SUBSTRATES; WAFER BONDING PROCESS; YIELD;

GALLIUM ARSENIDE; PRODUCTION ENGINEERING; SAPPHIRE; SEMICONDUCTING GALLIUM; SILICON WAFERS;

WAFER BONDING;

EID: 34250794739 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (13)

References (10)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.