Study on the soldering in partial melting state (1) - analysis of surface tension and wettability

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1145-1152

  Park, Jae Yong ^a   Ha, Jun Seok ^a   Kang, Choon Sik ^a   Shin, Kyu Sik ^b   Il Kim, Moon ^b   Jung, Jae Pil ^b  

^a Seoul National University   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CORRELATION THEORY; LEAD ALLOYS; LIQUID METALS; MELTING; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE TENSION; THERMAL EFFECTS; WETTING;

LEAD TIN ALLOYS; PARTIAL MELTING STATE; SILVER TIN ALLOYS; TIN BISMUTH ALLOYS; TIN INDIUM ALLOYS; WETTABILITY;

TIN ALLOYS;

EID: 0034297730     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0005-8     Document Type: Article

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