Delamination and electromigration of film lines on polymer substrate under electrical loading

IEEE Electron Device Letters

Volumn 30, Issue 1, 2009, Pages 11-13

  Wang, Qing Hua ^a   Xie, Hui Min ^a   Feng, Xue ^a   Chen, Zejing ^a   Dai, Fu Long ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Buckle driven delamination; Electrical loading; Electromigration; Film; Fracture

Indexed keywords

BUCKLING; DELAMINATION; ELECTROMECHANICAL DEVICES; FRACTURE; MEMS; MICROELECTROMECHANICAL DEVICES; STEEL SHEET; STRESS CONCENTRATION; SUBSTRATES;

BUCKLING STRESSES; ELECTRICAL LOADING; EULER FORMULAS; FILM FRACTURES; INFLUENCING FACTORS; MICRO-ELECTRO-MECHANICAL SYSTEMS; POLYMER SUBSTRATES; POSTBUCKLING ANALYSES; RESIDUAL STRESS DISTRIBUTIONS; THERMAL MISMATCHES;

ELECTROMIGRATION;

EID: 58149492934     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2008.2008401     Document Type: Article

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