The effect of various electrolyte concentrations on surface and electrical characteristic of the copper deposition layer at anodizing of titanium anode

Journal of Korean Institute of Metals and Materials

Volumn 46, Issue 11, 2008, Pages 747-754

  Lee, Man Hyung ^a   Park, Eun Kwang ^a   Woo, Tae Gyu ^a   Park, Il Song ^a   Yoon, Young Min ^a   Seol, Kyeong Won ^a  

^a Chonbuk National University   (South Korea)

Author keywords

Anodic oxidation; Electrodeposition; Sheet resistance; Spark discharge

Indexed keywords

EID: 58149458335     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (28)

1. T. X. Liang, Y. Q. Liu, Z. Q. Fu, T. Y. Luo, K. Y. Zhang, Thin Solid Films 473, 247 (2005).
2. Y. K. Lee, T. J. O'keefe, JOM. 54, 40 (2002).
3. M. Schlesinger, M. Paunovic, Modern Electroplating, 4th ed., Wiley New York, p. 63 (2000).
4. T. Yamakasi, P. Schlobmacher, K. Ehrlich, Y. Ogino, Nanostruct. Mater. 10, 375 (1998).
5. F. Czerwinski, Nanostruct. Mater. 10, 1363 (1998).
6. C. Wan, J. Lei, C. Bjelkevog, S. Rudenja, N. Magtoto, J. Kelber, Thin Solid Films 72, 445 (2003).
7. C. H. Seah, S. Mrdha, L.H. Chan, J. Mater. Process. Technol. 114, 233 (2001).
8. C. M. Whelan, M. R. Smyth, C. J. Barnes, J. Electroanal. Chem. 441, 109 (1998).
9. A. Kudelski, M. Janik-Czachor, J. Bukowska, M. Dolata, A. Szummer, J. Mol. Struct. 483, 245 (1999).
10. A. J. B. Dutraand, T.J.O'keefe, J. Appl. Electrochem. 29, 1217 (1999).
11. N. G. Hiroshi, USpatent, No. 4483906, 18 March (1983).
12. A. J. Brock, L. Lin, P. Menkin, N.W. Polan, USPatent, No. 5181770, 26 January (1993).
13. R. D. Apperson, S. J. Clouser and R. D. Patric, USPatent, No. 5403465, 4 April (1995).
14. S. J. Clouser, D. F. Franco and C. J. Hasegawa, USPatent, No. 5421985, 6 June (1995).
15. S. J. Clouser, R. Wiechmann, R. Schneider, U. Bohmlerand, R. D. Apperson, USpatent, No. 6132887, 24 May(1996).
16. H. Sun, J. L. Delplancke, R. Winand, T. J. O'Keefe, The Minerals, Met & Mater. Sci. Ottawa, Vol. III, 405 (1998).
17. J. L. Delpancke, M. Sun, T. J. O'Keefe and R. Winand, Hydrometallurgy 23, 47 (1989).
18. J. L. Delpancke, M. Sun, T. J. O'Keefe and R. Winand, Hydrometallurgy 24, 179 (1990).
19. C. W. Lee, Y. H. Hong, Y. H. Jang, Y. M. Hahm, Appl. Chemi. 1, 402, (1997).
20. H. Ishizawa, M. Ogino. J. Mater. Sci. 31, 6279 (1996).
21. B. Sun, M. Sato, A. Harano, J.S. Clements, J. Electrostatics. 43, 115 (1998).
22. W. W. Son, K. H. Kim, H. I. Kim, T. Hanawa, Y. S. Jeong, Biomater. Res. 4, 66, (2000).
23. H. L. Lee, Surface Engineering, Hyungseul publishing company (1999).
24. H. Sun, J. L. Delplancke, R. Winand, T. J. O'Keefe, Copper 91-Cobre 91 International Conference, Vol. III, 405, (1999).
25. H. A. Pack, Master's thesis, p. 10, Inha University (2005).
26. T. G. Woo, I. S. Park, M. H. Lee, E. K. Park, K. W. Seol, J. Kor. Inst. Met. & Mater. 45, 478 (2007).
27. S. Yoshimura, S. Yoshihara, T. Shirakashi, E. Sato, Electrochim. Acta. 39, 589 (1994).
28. D. N. Lee, J. Mater. Sci. Letters, 24, 4375 (1989).