Diffusion and adhesion properties of Cu films on polyimide substrates

Thin Solid Films

Volumn 473, Issue 2, 2005, Pages 247-251

  Liang, T X ^a   Liu, Y Q ^a   Fu, Z Q ^a   Luo, T Y ^a   Zhang, K Y ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Chemical vapor deposition (CVD); Copper; Physical vapor deposition (PVD); Titanium nitride

Indexed keywords

ADHESION; ANNEALING; CHEMICAL VAPOR DEPOSITION; DIFFUSION; METALLIZING; PHYSICAL VAPOR DEPOSITION; POLYIMIDES; RESIDUAL STRESSES; TENSILE STRESS; THERMAL STRESS; THIN FILMS; TITANIUM NITRIDE;

DIFFUSION BARRIERS; INTERCONNECT STRUCTURES; RESIDUAL TENSILE STRESS; SIGNAL PROPAGATION;

COPPER;

EID: 10644285572     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.07.073     Document Type: Article

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