The effect of surface morphology and crystal structure on the thickness of copper foil

Journal of Korean Institute of Metals and Materials

Volumn 45, Issue 8, 2007, Pages 478-483

  Woo, Tae Gyu ^a   Park, Il Song ^a   Lee, Man Hyung ^a   Park, Eun Kwang ^a   Seol, Kyeong Won ^a  

^a Chonbuk National University   (South Korea)

Author keywords

Copper thickness; Heating treatment; Resistivity; Surface characteristics

Indexed keywords

EID: 34548573194     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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