Removal of HF/CO2 post-etch residues from pattern wafers using water-in-carbon dioxide microemulsions

Microelectronic Engineering

Volumn 86, Issue 2, 2009, Pages 165-170

  Jung, Jae Mok ^a   Ganapathy, Hullathy Subban ^a   Yuvaraj, Haldorai ^a   Johnston, Keith P ^b   Lim, Kwon Taek ^a  

^a Pukyong National University   (South Korea)

^b The University of Texas at Austin   (United States)

Author keywords

BPSG pattern wafers; Cleaning; HF CO2 etch residues; Supercritical CO2; Surfactants; W C microemulsions

Indexed keywords

AMMONIUM COMPOUNDS; CARBON DIOXIDE; CARBOXYLATION; COLLOIDS; ETHYLENE; IONIZATION OF LIQUIDS; MICROEMULSIONS; SOLVENTS; SURFACE ACTIVE AGENTS;

BPSG PATTERN WAFERS; HF/CO2 ETCH RESIDUES; SUPERCRITICAL CO2; SURFACTANTS; W/C MICROEMULSIONS;

DEWATERING;

EID: 58149270896     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.09.006     Document Type: Article

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