Heat removal from power electronics in two direction sets using embedded solid state cooling layers a proposed non-numerical calculation method

Heat Transfer Engineering

Volumn 30, Issue 6, 2009, Pages 452-465

  Dirker, Jaco ^a   Meyer, Josua P ^a  

^a UNIVERSITY OF PRETORIA   (South Africa)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; COOLING; IMPACT RESISTANCE; NUMERICAL ANALYSIS; POWER ELECTRONICS; STRUCTURE (COMPOSITION); THEOREM PROVING; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL;

COMPOSITE COMPONENTS; COMPOSITE SOLIDS; FIRST ORDERS; GEOMETRIC SHAPES; GEOMETRIC SIZES; HEAT REMOVALS; INTEGRATED PASSIVES; INTERFACIAL RESISTANCES; INTERNAL INTERFACES; LOW THERMAL CONDUCTIVITIES; MATERIAL LAYERS; MATERIAL PROPERTIES; NUMERICAL CALCULATION METHODS; ORTHOGONAL DIRECTIONS; PEAK TEMPERATURES; POWER DENSITIES; SOLID STATES; THERMAL PERFORMANCES; THERMAL RESISTANCES;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 58149251821     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630802528745     Document Type: Article

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