The fabrication of carbon nanotubes reinforced copper coating by a kinetic spray process

Journal of Nanoscience and Nanotechnology

Volumn 8, Issue 10, 2008, Pages 5561-5565

  Xiong, Yuming ^a   Kang, Kicheol ^a   Yoon, Sanghoon ^a   Lee, Changhee ^a  

^a Hanyang University   (South Korea)

Author keywords

Multi Walled Carbon Nanotubes, Kinetic Sprayed Coating, Hardness, Electrical Resistivity

Indexed keywords

COPPER COATINGS; COPPER MATRIXES; COPPER SHEETS; ELECTRICAL CONDUCTIVITIES; ELECTRICAL RESISTIVITIES; KINETIC SPRAY PROCESSES; KINETIC SPRAYING; MULTI-WALLED CARBON NANOTUBES, KINETIC SPRAYED COATING, HARDNESS, ELECTRICAL RESISTIVITY; PURE COPPERS;

CHEMICAL SENSORS; COATINGS; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; GRAIN GROWTH; GRAIN SIZE AND SHAPE; GROWTH (MATERIALS); HARDNESS; HEAT TREATING FURNACES; HEAT TREATMENT; METALLIC MATRIX COMPOSITES; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; NANOTUBES; PAPER SHEETING; PESTICIDES; REINFORCED PLASTICS; SPRAYED COATINGS;

CARBON NANOTUBES;

EID: 58149237455     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2008.1346     Document Type: Conference Paper

References (22)

1. K. Kuniya, H. Arakawa, T. Sakaub, H. Minorikawa, K. Akeyama, and T. Sakamoto, Japan. J. Inst. Met. 50, 583 (1986).
2. L. Lu, Y. F. Shen, X. H. Chen, L. H. Qian, and K. Lu, Science 304, 422 (2004).
3. F. S. Rober, Science 281, 940 (1998).
4. Z. Bian, R. J. Wang, W. H. Wag, T. Zhang, and A. Iniue, Adv. Func. Mater. 14, 55 (2004).
5. C. L. Xu, B. Q. Wei, R. Z. Ma, J. Liang, X. K. Ma, and D. H. Wu, Carbon 37, 855 (1999).
6. B. Lira, C. Kim, B. Kim, U. Shim, S. Oh, B. Sung, J. Choi, and S. Baik, Nanotech. 17, 5795 (2006).
7. Y. L. Yang, Y D. Wang, Y. Ren, C. S. He, J. N. Deng, J. Nan, J. G. Chen, and L. Zuo, Mater. Lett. 62, 47 (2008).
8. S. R. Dong, J. P. Tu, and X. B. Zhang, Mater. Sci. Eng. A 313, 83 (2001).
9. K. T. Kim, S. I. Cha, and S. H. Hong, Mater. Sci. Eng. A 449-451, 46 (2007).
10. Y. Feng, H. L. Yuan, and M. Zhang, Mater. Charact. 55, 211 (2005).
11. A. P. Alkhimov, A. N. Papyrin, V. F. Kosarev, N. I. Nesterovich, and M. M. Shushpanov, U.S. Patent No. 5302414 (1994).
12. T. Stoltenhoff, C. Borchers, F. Gartner, and H. Kreye, Surf. Coat. Tech. 200, 4947 (2006).
13. P. S. Phani, V. Vishnukanthan, and G. Sundararajan, Acta Mater. 55, 4741 (2007).
14. W. B. Choi, L. Li, V. Luzin, R. Neiser, T. Gnäupel-Herold, H. J. Prask, S. Sampath, and A. Gouldstone, Acta Mater. 55, 857 (2007).
15. S. Yoon, C. Lee, H. Choi, and H. Jo, Mater. Sci. Eng. A 415, 45 (2006).
16. M. Perez-Ramos, A. Manzano-Ramirez, Y. Vorobiev, and J. Gonzalez-Hernandez, Metall. Mater. Trans. B 34, 129 (2003).
17. J. Pattison, S. Celotto, A. Khan, and W. O'Neill, Surf. Coat. Tech. 202, 1443 (2008).
18. W. Li, H. Liao, C. Li, G. Li, C. Coddet, and X. Wang, Appl. Surf. Sci. 252, 2852 (2006).
19. M. Chen, J. W. McCauley, and K. J. Hemker, Science 299, 1563 (2003).
20. T. W. Ebbesen, H. J. Lezec, H. Hiura, J. W. Bennett, H. F. Ghaemi, and T. Thio, Nature 382, 54 (1996).
21. H. J. Dai, E. W. Wong, and C. M. Lieber, Science 72, 523 (1996).
22. G. D. Zhan, J. D. Kuntz, J. E. Garay, and A. K. Mukherjee, Appl. Phys. Lett. 83, 1228 (2003).