Micro ribbon cable bonding for an implantable device

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 265-269

  Imenes, Kristin ^a   Aasmundtveit, Knut ^a   Bjørnsen, Geir ^a   Moreno, Pablo ^b   Vázquez De Aldana, Javier R ^b  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^b UNIVERSITY OF SALAMANCA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FLAT CABLES; PAPER; PLASMA ETCHING; STRIPPING (DYES);

CONDUCTIVE ADHESIVES; FEMTO SECONDS; IMPLANTABLE DEVICES; SIGNAL CABLES; SUBSTRATE BONDINGS; TWO DIFFERENT METHODS; WEDGE BONDINGS;

CABLES;

EID: 58149100665     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684360     Document Type: Conference Paper

References (9)

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