Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1291-1294

  Gain, Asit Kumar ^a   Chan, Y C ^a   Yung, K C ^b   Sharif, Ahmed ^a   Ali, Latir ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BRAZING; DUCTILE FRACTURE; HYDROGEN EMBRITTLEMENT; LEAD; MICROSTRUCTURE; NICKEL; POWDERS; SOLDERING ALLOYS; WELDING; ZINC;

BALL GRID ARRAY PACKAGES; BALL GRIDS; FRACTURE SURFACES; INTERFACIAL MICROSTRUCTURES; LEAD-FREE SOLDERS; NI POWDERS; PAD METALLIZATION; SHEAR LOADS; SN-8ZN-3BI; STRUCTURE AND PROPERTIES;

TIN;

EID: 58149086226     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684540     Document Type: Conference Paper

References (13)

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