Reflectionless design for differential-via transitions using neural network-based approach

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 143-146

  Jeng, Yung Shou ^a   Guo, Wei Da ^a   Shiue, Guang Hwa ^a   Lin, Chien Min ^b   Wu, Ruey Beei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

NEURAL NETWORKS; REFLECTION;

DO-MAINS; IMPEDANCE MATCHING; NOVEL DESIGNS; PHYSICAL DIMENSIONS; REFLECTOMETRY; WAVE SIMULATIONS;

ELECTRONICS PACKAGING;

EID: 47949085880     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387145     Document Type: Conference Paper

References (7)

1. E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, and D. Morlion, "Modeling differential via holes," IEEE Trans. Adv. Packag., vol. 24, pp. 357-363, Aug. 2001.
2. F. Jun, J. L. Drewniak, and J. L. Knighten, "Lumped-circuit model extraction for vias in multilayer substrates," IEEE Trans. Electromagn. Compat., vol. 45, pp. 272-280, May 2003.
3. S.-G. Hsu and R.-B. Wu, "Full wave characterization of a through hole via using the matrix-penciled moment method," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1540-1547, Aug. 1994.
4. P. Watson and K. C. Gupta, "EM-ANN models for via interconnects in microstrip circuits," in IEEE MTT-S Int. Microwave Symp. Dig., pp. 1819-1822, 1996.
5. X. Ding, V. K. Devabhaktuni, B. Chattaraj, M. C. E. Yagoub, M. Deo, J. Xu, and Q. J. Zhang, "Neural-network approaches to electromagnetic-based modeling of passive components and their applications to high-frequency and high-speed nonlinear circuit optimization," IEEE Trans. Microwave Theory Tech., vol. 52, pp. 436-449, Jan. 2004.
6. Microwave Studio, Version 5.1, Computer Simulation Technology (www.cst.com).
7. High Frequency Structure Simulator, Version 9.1, Ansoft Corporation (www.ansoft.com).