Switching noise suppression in mixed signal system applications using electromagnetic band gap (EBG) synthesizer

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2006, Pages 47-50

  Kim, Tae Hong ^a   Engin, Ege ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY GAP; GENETIC ALGORITHMS; SPURIOUS SIGNAL NOISE;

ELECTROMAGNETIC BAND GAPS; MIXED-SIGNAL SYSTEMS; NOISE ISOLATION; NOISE SUPPRESSION; SWITCHING NOISE SUPPRESSION;

ELECTRIC SIGNAL SYSTEMS;

EID: 50049096031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2006.321187     Document Type: Conference Paper

References (7)

1. J. Browne, "Fast Data Converters Advance Wireless Systems", Analog Devices. Inc. March 2005
2. T. H. Kim, J. Lee, H. Kim, and J. Kim, "3GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB," IEEE Electrical Performance of Electronic Packaging, pp. 217-220, Oct. 2002.
3. J. Choi, V. Govind, and M. Swaminathan. "A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications," IEEE Radio and Wireless Conf., Atlanta, GA, Sep. 2004, pp.243-246
4. T. H. Kim, D. Chung, E. Engin, W. Yun, Y. Toyota, and M. Swaminathan, "A Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems," IEEE Electronic Components and Technology Conference, May 2006.
5. T. Kamgaing, and O.M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003.
6. Y. Toyota, E. Engin, T.H. Kim, M. Swaminathan, and K. Uriu, "Stopband Prediction with Dispersion Diagram for Electromagnetic Bandgap Structures in Printed Circuit Boards," IEEE EMC Symposium, Portland OR, Aug. 2006
7. th Int. Zurich Symposium Electromagnetic Compatibility, Singapore, pp.549-552, Mar. 2006.