Properties of a permeation barrier material deposited from hexamethyl disiloxane and oxygen

Journal of the Electrochemical Society

Volumn 156, Issue 2, 2009, Pages

  Han, Lin ^a   Mandlik, Prashant ^a,b   Gartside, Jonathan ^a,c   Wagner, Sigurd ^a   Silvernail, Jeff A ^b   Ma, Rui Qing ^b   Hack, Michael ^b   Brown, Julie J ^b  

^a Princeton University   (United States)

^b UNIVERSAL DISPLAY CORPORATION   (United States)

^c NONE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ABSORPTION SPECTROSCOPY; ATOMIC SPECTROSCOPY; CONTACT ANGLE; ELECTROMAGNETIC WAVE ABSORPTION; ENERGY ABSORPTION; FRACTURE TOUGHNESS; LIGHT ABSORPTION; LIGHT EMISSION; LIGHT REFRACTION; NONMETALS; OPTICAL MICROSCOPY; OPTICAL PROPERTIES; ORGANIC POLYMERS; OXYGEN; PHOTORESISTS; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; REFRACTIVE INDEX; REFRACTOMETERS; SILICA; SPECTRUM ANALYSIS; SURFACE ROUGHNESS; TENSILE STRAIN; THERMAL SPRAYING; THERMAL STRESS; WATER ABSORPTION;

ATOMIC FORCES; BARRIER LAYERS; COEFFICIENT OF THERMAL EXPANSIONS; CONTINUOUS TRANSITIONS; CRITICAL STRAINS; DISILOXANE; ELECTRICAL CONDUCTIONS; ENCAPSULANT; EXPANSION COEFFICIENTS; INDENTATION HARDNESSES; IR ABSORPTION SPECTRUMS; LOW PERMEABILITIES; OPTICAL ABSORPTION SPECTRUMS; OPTICAL TRANSMITTANCES; PERMEATION BARRIER MATERIALS; PRECURSOR GASES; RELATIVE DIELECTRIC CONSTANTS; SILICON DIOXIDES; THERMAL OXIDATIONS; WET AND DRIES; WETTING CONTACT ANGLES;

THERMAL EXPANSION;

EID: 58049097429     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3028308     Document Type: Article

References (17)

1. P. Mandlik, J. Gartside, L. Han, I. Cheng, and S. Wagner, Appl. Phys. Lett., 92, 103309 (2008).
2. J. S. Lewis and M. S. Weaver, IEEE J. Sel. Top. Quantum Electron., 10, 45 (2004).
3. Y. Hamada, C. Adachi, T. Tsutsui, and S. Saito, Jpn. J. Appl. Phys., Part 1, 31, 1812 (1992).
4. B. D. Lee, Y. Cho, and W. Kim, Appl. Phys. Lett., 90, 103518-1-3 (2007).
5. J. Andersons, J. Modniks, Y. Leterrier, G. Tornare, P. Dumont, and J.-A. E. Manson, Theor. Appl. Fract. Mech., 49, 151 (2008).
6. B. Singh, J. Bouchet, G. Rochat, Y. Leterrier, J.-A. E. Manson, and P. Fayet, Surf. Coat. Technol., 201, 7107 (2007).
7. M. S. Weaver, A. Michalski, K. Rajan, M. A. Rothman, J. A. Silvernail, J. J. Brown, P. E. Burrows, G. L. Graff, M. E. Gross, P. M. Martin, Appl. Phys. Lett., 81, 2929 (2002).
8. T. W. Kim, M. Yan, A. G. Erlat, P. A. McConnelee, M. Pellow, J. Deluca, T. P. Feist, A. R. Duggal, and M. Schaepkens, J. Vac. Sci. Technol. A, 23, 971 (2005).
9. M. Schaepkens, T. W. Kim, A. G. Erlat, M. Yan, K. W. Flanagan, C. M. Heller, and P. A. McConnelee, J. Vac. Sci. Technol. A, 22, 1716 (2004).
10. E. Finot, S. Roualdes, M. Kirchner, V. Riyessac, R. Berjoan, J. Durand, J. P. Goudonnet, and L. Cot, Appl. Surf. Sci., 187, 326 (2002).
11. J. Coppeta, C. Rogers, A. Philipossian, and F. B. Kaufman, CMP-MIC Conference, Materials Research Society, p. 307 (1997).
12. A. Morinaka and Y. Asano, J. Appl. Polym. Sci., 27, 2139 (1982).
13. H. Sunami, Y. Itoh, and K. Sato, J. Appl. Phys., 41, 5115 (1970).
14. T. Y. Tsui, W. C. Oliver, and G. M. Pharr, J. Mater. Res., 11 (3), 752 (1996).
15. A. G. Erlat, B.-C. Wang, R. J. Spontak, Y. Tropsha, K. D. Mar, D. B. Montgomery, and E. A. Vogler, J. Mater. Res., 15, 704 (2000).
16. A. G. Erlat, R. J. Spontak, R. P. Clarke, T. C. Robinson, P. D. Haaland, Y. Tropsha, N. G. Harvey, and E. A. Vogler, J. Phys. Chem. B, 103, 6047 (1999).
17. A. Chwang, J. Lu, C. Shih, Y.-J. Tung, R. Hewitt, M. Hack, J. Ho, and J. Brown, Proc. SPIE 5801, 132 (2005).