Preparation of ultra-fine copper powder and its lead-free conductive thick film

Materials Letters

Volumn 61, Issue 16, 2007, Pages 3526-3530

  Wu, Songping ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Cu powders; Lead free glass; Microstructure; Solid solution; Thick film; Ultra fine

Indexed keywords

CONDUCTIVE FILMS; COPPER POWDER; MICROSTRUCTURE; REDUCTION; SOLID SOLUTIONS; SYNTHESIS (CHEMICAL);

COPPER METALLIC POWDERS; INTERFACIAL REACTION; LEAD FREE GLASS; LEAD-FREE GLASS POWDERS;

THICK FILMS;

EID: 34248333459     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2006.11.128     Document Type: Article

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