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Zheng, G.F.1
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84868901842
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The growth substrate consisted of 250 nm Au nanoparticles immobilized on poly-L-lysine treated 600 nm SiO2/Si slivers. The chamber temperature and pressure were held constant at 450 °C and 40 torr, respectively, and the precursor gases silane (2 sccm, dioborane (5 sccm, 100 ppm, and phosphine (1 sccm, 1000 ppm) were introduced as appropriate to form intrinsic, p-type, and n-type regions on the axial NW. The carrier gas was H2 (60 sccm, Under these conditions and NW diameter in the range of 200-250 nm, the growth rate is ∼1 μm/min. The dopant feed-in ratios (Si-B/P) were 2000:1 for both p- and n-type segments. For the tandem structures, the two i-segments were 2 μu long, the n+ and p+ regions were 0.5 μm in length, and the Si-B/P ratios were both 500:1 in the heavily doped n+ and p+ regions
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2 (60 sccm). Under these conditions and NW diameter in the range of 200-250 nm, the growth rate is ∼1 μm/min. The dopant feed-in ratios (Si-B/P) were 2000:1 for both p- and n-type segments. For the tandem structures, the two i-segments were 2 μu long, the n+ and p+ regions were 0.5 μm in length, and the Si-B/P ratios were both 500:1 in the heavily doped n+ and p+ regions.
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84868897797
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2 flow of 1 L/min. The oxide was removed by submerging the substrates in commercial buffered hydrogen fluoride (BHF) solution (Transene Company Inc.) for 5 s.
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2 flow of 1 L/min. The oxide was removed by submerging the substrates in commercial buffered hydrogen fluoride (BHF) solution (Transene Company Inc.) for 5 s.
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84868897796
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SiNWs were etched with BHF for 7 s and then immersed in a 60 °C KOH/isopropanol solution 20 wt % KOH in water; 3:1 for 7 s. SEM studies reveal that the etching rate for i-type Si is similar to that for p-type, leading to a 52% and 46%, respectively, reduction in the original diameter for above conditions, while there is negligible etching for n-type Si.
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SiNWs were etched with BHF for 7 s and then immersed in a 60 °C KOH/isopropanol solution (20 wt % KOH in water; 3:1 vol/vol) for 7 s. SEM studies reveal that the etching rate for i-type Si is similar to that for p-type, leading to a 52% and 46%, respectively, reduction in the original diameter for above conditions, while there is negligible etching for n-type Si.
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84868912127
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2 = 1 sun) with a power meter (Coherent, Field Master). For temperature dependent experiments (Figure 3C), the probe station (Desert Cryogenics, Model TTP4) tip and substrate temperatures (LakeShore, Model 331 temperature controller) were within 5% of each other.
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2 = 1 sun) with a power meter (Coherent, Field Master). For temperature dependent experiments (Figure 3C), the probe station (Desert Cryogenics, Model TTP4) tip and substrate temperatures (LakeShore, Model 331 temperature controller) were within 5% of each other.
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Yang, C; Barrelet, C. J.; Capasso, F.; Lieber, C. M. Nano Lett. 2006, 6, 2929.
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Yang, C.1
Barrelet, C.J.2
Capasso, F.3
Lieber, C.M.4
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84868912128
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The projected area used to calculate efficiency was approximated as the length of the intrinsic region and the depletion widths in the p-and n- regions multiplied by the NW diameter. If the entire length between the contacts of the p-i 4 μm, n axial device was used to estimate area, the efficiency would be 0.15% and Jsc, 1.4 mA/cm2. We believe that the smaller projected area corresponding primarily to the i-segment is the best measure of the device performance, because of the short depletion widths and minority carrier diffusion lengths in the heavily doped p- and n-regions
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2. We believe that the smaller projected area corresponding primarily to the i-segment is the best measure of the device performance, because of the short depletion widths and minority carrier diffusion lengths in the heavily doped p- and n-regions.
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84868897799
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oc will depend logarithmically on intensity (Figure 3A).
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oc will depend logarithmically on intensity (Figure 3A).
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Huynh, W. U.; Dittmer, J. J.; Alivisatos, A. P. Science 2002, 295, 2425.
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Huynh, W.U.1
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20144369634
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Law, M.; Greene, L. E.; Johnson, J. C; Saykally, R.; Yang, P. Nat. Mater. 2005, 4, 455.
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Law, M.1
Greene, L.E.2
Johnson, J.C.3
Saykally, R.4
Yang, P.5
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Ambrosone, G.; Coscia, U.; Murri, R.; Pinto, N.; Ficcadenti, M.; Morresi, L. Solar Energy Materials and Solar Cells 2005, 87, 375.
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Ambrosone, G.1
Coscia, U.2
Murri, R.3
Pinto, N.4
Ficcadenti, M.5
Morresi, L.6
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