Silicon integrated vapor chamber equipped with integrated sensor network for in-situ thermal monitoring and cooling optimization

14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Volumn , Issue , 2008, Pages 173-176

  Bercu, Bogdan ^a   Montès, Laurent ^a   Morfouli, Panagiota ^a  

^a UNIVERSITÉ DE SAVOIE   (France)

Author keywords

Advanced cooling technique; Silicon integrated heatspreader; Temperature sensors

Indexed keywords

COOLING SYSTEMS; HEAT CONDUCTION; HEAT FLUX; HEATING EQUIPMENT; SENSOR NETWORKS; SILICON; SPREADERS; SUBSTRATES; TEMPERATURE SENSORS; THERMAL MANAGEMENT (ELECTRONICS); THERMOELECTRIC EQUIPMENT;

COOLING OPTIMIZATION; COOLING TECHNIQUE; HEAT CONDUCTION COEFFICIENT; HEAT SPREADERS; IN- SITU MONITORING; MEASUREMENT ACCURACY; TEMPERATURE AND PRESSURES; THERMAL MONITORING;

ELECTRONIC COOLING;

EID: 57649180873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2008.4669903     Document Type: Conference Paper

References (11)

1. I. Dolezel, P. Dvorak, K. Kalcik, V. Valouch, "Limit Operation Regimes of Selected Power Semiconductor Element", 12th International Power Electronics & Motion Control Conference, pp. 50-53 (2006)
2. M. Le Berre, S. Launay, V. Sartre, M. Lallemand, "Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics", J. of Micromech. and Microeng., Vol. 13 (2003), pp. 436-441.
3. T. Q. Feng, J. L. Xu, "An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling", Appl. Therm. Eng., Vol. 24 (2004), pp. 323-337.
4. th IAS Annual Meeting, October 2004, pp. 2296-2302 (Vol. 4)
5. R. Rulliere, F. Lefevre, M. Lallemand, "Modeling of a two phase heatspreader", 17th French Congress of Mechanics, 29 august - 2 September 2005, Troyes, France
6. G. Blasquez, P. Pons, A. Eoukabache, "Capabilities and limits of silicon pressure sensors", Sensor. Actuator. Phys., Vol. 17 (1989), pp. 387-404.
7. C. S. Smith, "Piezoresistance Effect in Germanium and Silicon", Phys. Rev., Vol. 94, No. 1 (1954), pp. 42-49.
8. S. Renard, "Industrial MEMS on SOI", J. Micromech. Microeng., Vol. 10 (2000), pp. 245-249
9. B. Bercu, L. Montes, P. Morfouli, "FEA Calculations for Ultra Thin Piezoresistive Pressure Sensor on SOI for Heatspreader Integration", 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2006. 24-26 April 2006
10. A. Szmyrka-Grtebyk, L. Lipiriski, "Linear diode thermometer in the 4-300 K temperature range", Cryogenics, Vol. 35, pp. 281-284 (1995)
11. B. Bercu, L. Montès, P. Morfouli, "Silicon chip Built-in Heat Spreader: Characterization And Optimization Using Integrated Sensors", European Advanced Technology Workshop on Micropackaging and Thermal Management, 30th - 31st January, 2008, La Rochelle, France