High throughput measurement techniques for wafer level yield inspection of MEMS devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7155, Issue , 2008, Pages

  Varela Pedreira, O ^a,b   Lauwagie, T ^b   De Coster, J ^a   Haspeslagh, L ^a   Witvrouw, A ^a   De Wolf, I ^c  

^a IMEC   (Belgium)

^b Dynamic Design Solutions NV   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Differential interference contrast; High throughput; MEMS; Wafer level test; White light interferometer; Yield inspection

Indexed keywords

DAMAGE DETECTION; INTERFEROMETERS; INTERFEROMETRY; MEMS; MICROELECTROMECHANICAL DEVICES; PARAMETER EXTRACTION; PARAMETRIC DEVICES;

DIFFERENTIAL INTERFERENCE CONTRAST; HIGH THROUGHPUT; WAFER-LEVEL TEST; WHITE-LIGHT INTERFEROMETER; YIELD INSPECTION;

THROUGHPUT;

EID: 57549097826     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814724     Document Type: Conference Paper

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