A novel Ag-Cu lamination process

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2007, Pages 205-207

  Wang, Pin J ^a   Kim, Jong S ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; GRAPHITE; SUBSTRATES;

LAMINATING PROCESS; VACUUM ENVIRONMENT;

SILVER;

EID: 44449172057     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2007.4419941     Document Type: Conference Paper

References (9)

1. nd edition, Chapman & Hall, New York, 1997
2. Xingsheng Liu, S. Haque, Jinggang Wang, and Guo-Quan Lu, "Packaging of integrated power electronics modules using flip-chip technology," IEEE Applied Power Electronics Conference and Exposition, 1, pp. 290-296, New Orleans, LA, 2000
3. th edition, 2, ASM International, 1990
4. http://emat.eng.hmc.edu/
5. th Annual Applied Power Electronics Conference and Exposition, 2, pp. 1240-1246, 2004
6. Siu-Wai Chan, "Direct TEM Observation of the Welding of Asperities Between Two Single-Crystal Gold Films," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12, pp.39-42, 1989
7. Jain-Guo Luo and Viola L. Acoff, "Using cold roll bonding and annealing to process Ti/Al multi-layered composites from elemental foils," Materials Science and Engineering A, 379, pp. 164-172, 2004
8. S. Tosti, "Supported and laminated Pd-based metallic membranes," International Journal of Hydrogen Energy, 28, pp. 1445-1454, 2003
9. Chin C. Lee, Dave T. Wang, and Won S. Choi, "Design and construction of a compact vacuum furnace for scientific research," Review of Scientific Instruments (American Institute of Physics), 77, 125104, Dec. 2006.