Determining the stress required for deformation twinning in nanocrystalline and ultrafine-grained copper

JOM

Volumn 60, Issue 9, 2008, Pages 66-70

  Sriram, Vinay ^a   Yang, Jenn Ming ^a   Ye, Jia ^b   Minor, Andrew M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Lawrence Berkeley National Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; COPPER; DENSITY (SPECIFIC GRAVITY); GRINDING (MACHINING); MATERIALS PROPERTIES; MECHANICAL PROPERTIES; METAL EXTRUSION; METALLURGY; MICROSCOPIC EXAMINATION; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS; SHEAR STRESS; STRENGTH OF MATERIALS; STRESSES;

CHANNEL ANGULAR EXTRUSIONS; CRYOMILLING; DEFORMATION TWINNINGS; DEFORMATION TWINS; HIGH DENSITIES; NANOCRYSTALLINE; PROCESSING CONDITIONS; TWIN BOUNDARIES; ULTRAFINE; ULTRAFINE-GRAINED MATERIALS; YIELD STRENGTHS;

DEFORMATION;

EID: 56349142681     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-008-0121-0     Document Type: Article

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