Work hardening of ultrafine-grained copper with nanoscale twins

Scripta Materialia

Volumn 57, Issue 2, 2007, Pages 133-136

  Chen, X H ^a   Lu, L ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Nanoscale twins; Ultrafine grained copper; Work hardening coefficient; Work hardening rate

Indexed keywords

DEFORMATION; ELECTRODEPOSITION; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; TENSILE TESTING;

NANOSCALE TWINS; ULTRAFINE GRAINED COPPER; WORK HARDENING COEFFICIENTS; WORK HARDENING RATE;

COPPER;

EID: 34247614423     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.03.029     Document Type: Article

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