Temperature dependence of electroless Ni-P deposition on polyester fabric

Surface Review and Letters

Volumn 15, Issue 5, 2008, Pages 587-593

  Guo, R H ^a   Jiang, S Q ^a   Yuen, C W M ^a   Ng, M C F ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Electroless Ni P plating; Electromagnetic interference shielding; Microstructure; Polyester fabric; Surface resistance

Indexed keywords

ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTROMAGNETIC WAVES; ELECTROPLATING; FABRICS; MICROSCOPIC EXAMINATION; NICKEL; NICKEL ALLOYS; PLATING; RADIATION PROTECTION; RADIATION SHIELDING; SHIELDING; SIGNAL INTERFERENCE; SPONTANEOUS EMISSION; SURFACE MORPHOLOGY; SURFACE STRUCTURE;

AMORPHOUS STRUCTURES; ELECTRICAL RESISTANCES; ELECTROLESS NI; ELECTROLESS NI-P PLATING; ELECTROMAGNETIC INTERFERENCE SHIELDING; ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESSES; P LAYERS; PLATING BATHS; PLATING LAYERS; PLATING RATES; POLYESTER FABRIC; POLYESTER FABRICS; TEMPERATURE DEPENDENCES;

SURFACE RESISTANCE;

EID: 55849123265     PISSN: 0218625X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0218625X08011780     Document Type: Article

References (30)

1. A. Tsaliovich, Electromagnetic Shielding Handbook for Wired and Wireless EMC Applications (Kluwer Academic, 1999).
2. C. Y. Huang, W. W. Mo and M. L. Roan, Surf. Coal. Technol. 184 (2004) 123.
3. M. Farsi, Int. Technol. Eng. Master 228 (1988).
4. O. S. Kwon, J. C. Jung and Y. H. Yoo, Polymer (Korea) 7(6) (1983) 342.
5. S. Yasufuku, IEEE Elec. Insulal. Mag. 6(6) (1995) 947.
6. W. C. Smith, J. Coat. Fabrics. 17 (1988) 243.
7. K. Bula, J. Koprowska and J. Janukiewicz, Fibers Text. Eastern. Eur. 14(5) (2006) 75.
8. S. Q. Jiang, E. Newton, C. W. M. Yuen and C. W. Kan, Text. Res. J. 76 (2006) 57.
9. R. H. Guo, S. Q. Jiang, C. W. M. Yuen and M. C. F. Ng, J. Mater. Sci.: Mater. Electron. (2008) DOI 10.1007/s10854-008-9594-4.
10. G. O. Mallory and J. B. Hadju, Electroless Plating (AESF, Orlando Florida, 1990).
11. W. Riedel, Electroless Nickel Plating (Finishing Publishers Ltd., England, 1991).
12. H. B. Dai, H. X. Li and F. H. Wang, Appl. Surf. Sci. 253 (2006) 2474.
13. J. N. Balaraju, S. Millath Jahan, A. Jain, K. S. Rajama, J. Alloys Compd. 438 (2007) 319.
14. R. N. Duncan, Plat. Surf. Finish. 83 (1998) 65.
15. C. W. M. Yuen, S. Q. Jiang, C. W. Kan and W. S. Tung, Appl. Surf. Sci. 253 (2007) 5250.
16. M. Simor, J. Rahel, M. Cernak, Y. Imahori, M. Stefecka and M. Kandobc, Surf. Coat. Technol. 172 (2003) 1.
17. C. W. Kan, C. W. M. Yuen, S. Q. Jiang and W. S. Tung, Res. J. Tex. App. 11(3) (2007) 60.
18. M. R. Lambert and D. J. Duquette, Thin Solid Films 177 (1989) 207.
19. L. J. Wang, L. Juan and Y. X. Liu, J. Forestry Res. 17(1) (2006) 53.
20. L. M. Abrantes and J. P. Correya, J. Electrochem. Soc. 141 (1994) 2356.
21. M. Ebn Touhami, E. Chassaing and M. Cherkaoui, Eleclrochim. Acta 43 (1998) 1721.
22. W. J. Cheong. B. L. Luan and D. W. Shoesmith, Appl. Surf. Sci. 229 (2004) 282.
23. A. X. Zeng, W. H. Xiong and J. Xu, Surf. Coat. Technol. 197 (2005) 142.
24. H. B. Dai, H. X. Li and F. 11. Wang, Appl. Surf. Sci. 253 (2006) 2474.
25. J. W. Yoon, J. H. Park, C. C. Shur and S. B. Jung, Microelec. Eng. 84 (2007) 2552.
26. J. N. Balaraju, T. S. N. S. Narayanan and S. K. Seshadri, Mater. Res. Bull. 41 (2006) 847.
27. I. Baskaran, T. S. N. S. Narayanan and A. Stephen. Mater. Chem. Phys. 99 (2006) 17.
28. B. E. Warren, X-ray Diffraction (Addison-Wesley Publishing Company, 1969).
29. M. I. Mendelev and D. J. Srolovitz, Model. Simul. Mat. Sci. Eng. 10 (2002) R79.
30. C. R. Paul (ed.), Introduction of Electromagnetic Compatibility (Wiley. New York, 1992).