Characterization of acrylic copolymers applied in negative-type photoresist via a ternary composition diagram

Journal of Applied Polymer Science

Volumn 109, Issue 1, 2008, Pages 467-474

  Lee, Chih Kang ^a   Don, Trong Ming ^a   Lin, Dar Jong ^a   Chen, Chin Chung ^a   Cheng, Liao Ping ^a  

^a TAMKANG UNIVERSITY   (Taiwan)

Author keywords

Acrylic copolymer; Binder; Copolymerization; Negative type photoresist; Photoresists; Ternary composition diagram

Indexed keywords

ABS RESINS; ACIDS; BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; COPOLYMERIZATION; COPOLYMERS; ESTERS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FREE RADICAL POLYMERIZATION; FREE RADICALS; HYDRODYNAMICS; MOLECULAR WEIGHT; MONOMERS; ORGANIC COMPOUNDS; PHOTORESISTORS; PHOTORESISTS; PLASTIC PRODUCTS; POLYACRYLATES; POLYMERS; SURFACE TREATMENT; THERMOANALYSIS; VISCOSITY;

ACID VALUES; ACRYLIC COPOLYMER; ACRYLIC COPOLYMERS; ACRYLIC ESTERS; BENZYL METHACRYLATES; HYDROXYETHYL METHACRYLATES; METHACRYLIC ACIDS; NEGATIVE-TYPE PHOTORESIST; OPTIMAL REGIONS; SYNTHETIC PROCESSES; TERNARY COMPOSITION DIAGRAM; TERNARY COMPOSITIONS; TGA AND DSC; THERMAL ANALYSIS; THERMAL BEHAVIORS; THERMAL STABILITIES;

BINDERS;

ACRYLIC; BINDING AGENT; COPOLYMER; MOLECULAR WEIGHT; POLYMERIZATION; THERMAL PROPERTY;

EID: 55849101708     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28157     Document Type: Article

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