Process induced damages and recovery by silylation for low-k/Cu interconnects with highly-porous self-assembled silica film

Advanced Metallization Conference (AMC)

Volumn , Issue , 2008, Pages 513-519

  Kinoshita, Keizo ^a,d   Chikaki, Shinichi ^a   Soda, Eiichi ^a   Tomioka, Kazuhiro ^a   Tanaka, Hirofumi ^b   Kohmura, Kazuo ^b   Nakayama, Takahiro ^c   Kikkawa, Takamaro ^a,e   Saito, Shuichi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b MITSUI CHEMICALS INC   (Japan)

^c ULVAC INC   (Japan)

^d NEC CORPORATION   (Japan)

^e HIROSHIMA UNIVERSITY   (Japan)

Author keywords

HMDS; Ion energy; Porous silica; Recovery; Restoration; TMCTS; TMSDMA

Indexed keywords

AGENTS; ELECTRIC CURRENTS; ETCHING; IONS; METALLIZING; OXIDES; PERMITTIVITY; SILANES; SILICA;

HMDS; ION ENERGY; POROUS SILICA; TMCTS; TMSDMA;

RECOVERY;

EID: 55349138062     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. N. Fujii, et al., Proc. SPIE, 6002, 60020N-1 (2005).
2. K. Kohmura, et al.. Thin Solid Films, 515, 5019 (2007).
3. S. Chikaki, et al., Ext. Abst. IEDM2007, (2007), to be presented.
4. T. Kikkawa, Proc. ADMETA2003, 1-2, (2003); T. Kikkawa, et al., Ext. Abst. IEDM2005, 4.5, (2005).
5. T. Ono, et al., Jpn. J. Appl. Phys., 45, 6231 (2006).
6. E. Soda, et al., MRS Proc. AMC2005, 263 (2006).
7. T. Yamanishi, et al., J. Microelec. Eng., 83, 2142 (2006).
8. A. Kojima, et al., MRS Proc. AMC2006, 301 (2007).
9. K. Kinoshita, et al., Ext. Abst. AVS2007, PS1, (2007), to be presented.
10. Y. Sonoda, et al., Ext. Abst. Fall Meeting Jpn. Soc. Appl. Phys., 3p-M-12, (2004).
11. M. Hori, Proc. ISPC-18, 30C-pl, 324, (2007).