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Volumn 48, Issue 12, 2005, Pages 72-75
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Ultrasonic flip chip bonding
a
a
FUJIKURA LTD
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
MICROPROCESSOR CHIPS;
PRINTED CIRCUIT BOARDS;
RELIABILITY;
ULTRASONIC EFFECTS;
FLIP CHIP (FC) BONDING;
MOBILE PHONES;
BONDING;
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EID: 27944483293
PISSN: 10508171
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (4)
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References (0)
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