Current research and development status and prospect of hot-melt adhesives: A review

Industrial and Engineering Chemistry Research

Volumn 47, Issue 20, 2008, Pages 7524-7532

  Li, Wen ^a   Bouzidi, Laziz ^a   Narine, Suresh S ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ENERGY RESOURCES; RESEARCH AND DEVELOPMENT MANAGEMENT; SILICON SOLAR CELLS;

ENVIRONMENTAL CONCERNS; FUNDAMENTAL CHARACTERISTICS; ISSUES AND CHALLENGES; MATERIALS DEVELOPMENTS; MECHANICAL BEHAVIORS; RECENT DEVELOPMENTS; RESEARCH AND DEVELOPMENTS; STATUS AND PROSPECTS; TECHNOLOGICAL IMPROVEMENTS;

HOT MELT ADHESIVES;

EID: 54949096974     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie800189b     Document Type: Review

References (91)

1. Paul, C. W. Hot-Melt Adhesives. MRS Bull. 2003, 28, 440-445.
2. Barreueso-Martinez, B.; Ferrandiz-Gomez, T. D.; Maitin-Martinez, J. M.; Aran-Ais, F.; Torro-Palau, A. M.; Orgiles-Barcelo, A. C. EVA Hot-Melt Adhesives. Adhes. Age 2001, 44, 32-37.
3. Mitchell, R. D. Raw Materials for Hot Melt Adhesives in the 21st Century. Adhes. Age 1999, 42, 24-27.
4. Dahmane, H. Development of Environmentally Friendly Warm-Melt Adhesives for the Packaging Industry. Int. J. Adhes. Adhes. 1996, 16, 43-45.
5. Tout, R. A Review of Adhesives for Furniture. Int. J. Adhes. Adhes. 2000, 20, 269-272.
6. Pizzi, A.; Mittal, K. L. Handbook of Adhesive Technology; Dekker: New York, 2003.
7. Schwarte, J. Are Hot Melts Cooling Down. Adhes. Age 2001, 44, 7-10.
8. Growney, M. Blends of Poly(-caprolactone-b-lactic acid) and Poly-(lactic acid) for Hot-Melt Applications. J. Adhes. Sealant Counc. 1996, 12, 55-61.
9. Nelson, K. A. Overview of Hot Melt Adhesive Components. Hot Melt Symposium, Hilton Head Island, SC, June 10-13, 2001; pp 1-18.
10. Agger, R. T. The Current Situation for Hot-Melt Adhesives. Adhesion (London), 1989.
11. Gray, D. D. Pure Adhesives Offer Solutions for Assembly Challenges. Adhes. Age 1998, 41, 23-24.
12. Tora, S.; Cassen, D.; Haviarova, E. Properties of Hot-Melt Adhesives Used in Kitchen Cabinets. For. Prod. J. 2006, 56, 43-50.
13. Neter, J.; Kutner, M. H.; Nachtsheim, C. I.; Wassemian, W. Applied Linear Statistical Models, 4th ed.; Irwin: Chieatio, Italy, 1996; pp 141-158.
14. Kim, D. J.; Kim, H. J.; Yoon, G. H. Effect of Substrate and Tackifier on Peel Strength of SIS (styrene-isoprene-styrene)-Based HMPSAs. Int. J. Adhes. Adhes. 2005, 25, 288-295.
15. Bowman, J.; Christodoulou, M. Joining Metal and Plastics Surfaces. United States Patent 2006182954.
16. Park, Y. J.; Joo, H. S.; Kim, H. J.; Lee, Y. K. Adhesion and Rheological Properties of EVA-Based Hot-Melt Adhesives. Int. J. Adhes. Adhes. 2006, 26, 571-576.
17. Marin, G.; Derail, C. Rheology and Adherence of Pressure-Sensitive Adhesives. J. Adhes. 2006, 82, 469-485.
18. Badie, P.; Cavalie, H. Hot Melt Formulation: Miscibility and Adhesion. Hot Melt Symposium, Hilton Head Island, SC, June 10-13, 2001; pp 165-178.
19. Duffy, D. J.; Heintz, A. M.; Stidham, H. D.; Hsu, S. L.; Suen, W.; Chu, W.; Paul, C. W. The Competitive Influence of Specific Interactions and Extent of Reaction on the Miscibility of Ternary Reactive Polymer Blends: Model for Polyurethane Adhesives. J. Adhes. 2003, 79, 1091-1107.
20. Song, Z. Z.; Li, Y.; Smith, J. D. Enhanced Cell Attachment and Osteoblastic Activity by P-15 Peptide-Coated Matrix in Hydrogels. United States Patent 2007155859.
21. He, Q.; Harwell, M. G. Ionomer-Containing Hot Melt Adhesive. United States Patent 2007117934.
22. Linemann, A.; Bussi, P. Polar Group-Containing Olefin Copolymer, Process for Preparing the Same, Thermoplastic Resin Composition Containing the Copolymer, and Uses Thereof. EP Patent 2195.
23. Rossini, A.; Meda, F. Hot Melt Adhesives Based on Polyamides. EP Patent 1013694.
24. Everaerts, A.; Zieminski, K.; Nguyen, L.; Malmer, J. Cross-Linking of Hot-melt-Processible Acrylic Pressure-Sensitive Adhesives Using Acid/ Base Interaction. J. Adhes. 2006, 82, 375-387.
25. Fernandes, E. G.; Lombardi, A.; Solaro, R.; Chiellini, E. Thermal Characterization of Three-Component Blends for Hot-Melt Adhesives. J. Appl. Polym. Sci. 2001, 80, 2889-2901.
26. Kim, D. J.; Kim, H. J.; Yoon, G. H. Tack and Fracture Energy of Tackified SIS (styrene-isoprene-styrene)-Based Hot-Melt Pressure Sensitive Adhesives (HMPSAs). J. Adhes. Sci. Technol. 2006, 20, 1367-1381.
27. Hong, I. O.; Kim, W. K.; Kang, H. J. The Rheological, Thermal, and Mechanical Properties for Polypropylene and Amorphous Poly Alpha Olefin Blends. Polymer (Korea) 2000, 24, 513-519.
28. Case, A. Interfacial Diffusion of Fluids in Pressure Sensitive Adhesives. J. Adhes. Sealant Counc. 1997, 16, 189-217.
29. Morrison, B. D.; Patel, J. B.; Mehaffy, J. A. Hot Melt Adhesive. United States Patent 2005261416.
30. Slark, A. Moisture Curing Reactive Polyurethane Hot Melt Adhesive Modified with Acrylic Polymers. United States Patent 2004249076.
31. Popa, L. Thermo-Oxidative Degradation and Radio-Processing of Ethylene Vinyl Acetate Elastomers. Mater. Plastics(Bucharest) 2005, 42, 111114 (.
32. Edin, M.; Odberg, L.; Sterte, J. Hot Melt Adhesion of Liner Sized with Alkylketene Dimmer. Nord. Pulp Pap. Res. J. 2002, 17, 395-400.
33. Harwell, M. G.; Thatcher, J.; Mccauley, R. Hot Melt Adhesive Containing a Neutralizing Additive. United States Patent 2005032963.
34. Choi, W. Y.; Lee, C. M.; Park, H. J. Development of Biodegradable Hot-Melt Adhesive Based on Poly-ε-caprolactone and Soy Protein Isolate for Food Packaging System. Lebensm.-Wiss. Technol. 2006, 39, 591-597.
35. Hoppe, C. E.; Galante, M. J.; Oyanguren, P. A.; Williams, R. J. J. Epoxies Modified by Palmitic Acid: From Hot-Melt Adhesives to Plasticized Networks. Macromol. Mater. Eng. 2005, 290, 456-462.
36. Takemoto, M.; Kajiyama, M.; Mizumachi, H.; Takemura, A.; Ono, H. Miscibility and Adhesive Properties of Ethylene Vinyl Acetate Copolymer (EVA)-Based Hot-Melt Adhesives. I. Adhesive Tensile Strength. J. Appl. Polym. Sci. 2002, 83, 719-725.
37. Takemoto, M.; Kajiyama, M.; Mizumachi, H.; Takemura, A.; Ono, H. Miscibility and Adhesive Properties of EVA-Based Hot-Melt adhesives. H. Peel Strength. J. Appl. Polym. Sci. 2002, 83, 726-735.
38. Cazenave, M. N.; Derail, C.; Leonardi, F.; Marin, G.; Kappes, N. Rheological Properties of Hot Melt Pressure Sensitive Adhesives (HMPSAs) Based on Styrene - Isoprene Copolymers, Part 3: Rheological Behavior of Different Block Copolymers with High Diblock Content. J. Adhes. 2005, 81, 623-643.
39. Stolt, M.; Viljanmaa, M.; Sodergard, A.; Tormala, P. In Vitro Monitoring of Surface Mechanical Properties of Poly(L-lactic acid) Using Microhardness. J. Appl. Polym. Sci. 2004, 91, 196-204.
40. Duffy, D. J.; Stidham, H. D.; Hsu, S. L.; Sasaki, S.; Takahara, A.; Kajiyama, T. Influence of Polymer Structure on Melt Miscibility of Ternary Polymer Blends. J. Mater. Sci. 2002, 37, 4851-4859.
41. Shin, H. H.; Hamed, G. R. Peel Adhesion and Viscoelasticity of Poly(Ethylene-co-vinyl acetate)-Based Hot Melt Adhesives. I. The Effect of Tackifier Compatibility. J. Appl. Polym. Sci. 1997, 63, 323-331.
42. Shih, H. H.; Hamed, G. R. Peel Adhesion and Viscoelasticity of Poly(Ethylene-co-vinyl acetate)-Based Hot Melt Adhesives. II. The Influence of Wax. J. Appl. Polym. Sci. 1997, 63, 333-342.
43. Tse, M. F.; Hamed, G. R.; Tathgur, A. Adhesion and Failure Mechanisms of a Model Hot Melt Adhesive Bonded to Polypropylene. J. Adhes. 1997, 61, 1-25.
44. Derail, C.; Cazenave, M. N.; Gibert, F. X.; Marin, G.; Kappes, N.; Lechat, J. Rhological Properties of Hot Melt Pressure-Sensitive Adhesive Based on Styrene-Isoprene Copolymers. Part 1. J. Adhes. 2004, 80, 1131-1151.
45. Renvoise, J.; Burlot, D.; Marin, G.; Derail, C. Peeling of PSAs on Viscoelastic Substrates: A Failure Criterion. J. Adhes. 2007, 83, 403-416.
46. Park, Y. J.; Kim, H. J.; Rafailovich, M.; Sokolov, J. Viscoelastic Properties and Lap Shear Strength of EVA/Aromatic Hydrocarbon Resins as Hot-Melt Adhesives. J. Adhes. Sci. Technol. 2003, 17, 1831-1845.
47. Gibert, F. X.; Marin, G.; Derail, C.; Allal, A.; Lechat, J. Rheological Properties of Hot Melt Pressure-Sensitive Adhesive Based on Styrene-Isoprene Copolymers. Part 2. J. Adhes. 2003, 79, 825-852.
48. Cui, Y. J.; Hong, L.; Wang, X. L.; Tang, X. Z. Evaluation of the Cure Kinetics of Isocyanate Reactive Hot-Melt Adhesives with Differential Scanning Calorimetry. J. Appl. Polym. Sci. 2003, 89, 2708-2713.
49. Viljanmaa, M.; Sodergard, A.; Tormala, P. Int. J. Adhes. Adhes. 2002, 22, 219-226.
50. Viljanmaa, M.; Sodergard, A.; Tormala, P. Adhesion Properties of Lactic Acid Based Hot Melt Adhesives and Their Storage Stability in Different Packaging Applications. Int. J. Adhes. Adhes. 2002, 22, 447-457.
51. Viljanmaa, M.; Sodergard, A.; Mattila, R.; Tormala, P. Hydrolytic and Environmental Degradation of Lactic Acid Based Hot Melt Adhesives. Polym. Degrad. Stab. 2002, 78, 269-278.
52. Takemoto, M.; Kajiyama, M.; Mizumachi, H.; Takemura, A.; Ono, H. Miscibility and Adhesive Properties of EVA-Based Hot-melt Adhesives. H. Peel Strength. J. Appl. Polym. Sci. 2002, 83, 726-735.
53. Takemoto, M.; Kajiyama, M.; Mizumachi, H.; Takemura, A.; Ono, H. Miscibility and Adhesive Properties of Ethylene Vinyl Acetate Copolymer (EVA)-Based Hot-Melt Adhesives. I. Adhesive Tensile Strength. J. Appl. Polym. Sci. 2002, 83, 719-725.
54. Cui, Y. J.; Chen, D. H.; Wang, X. L.; Tang, X. Z. Crystalline Structure in Isocyanate Reactive Hot Melt Adhesives. Int. J. Adhes. Adhes. 2002, 22, 317-322.
55. Chen, X. M.; Zhong, H.; Jia, L. Q.; Ning, J. C.; Tang, R. G.; Qiao, J. L.; Zhang, Z. Y. Polyamides Derived from Piperazine and Used for Hot-Melt Adhesives: Synthesis and Properties. Int. J. Adhes. Adhes. 2002, 22, 75-79.
56. Fernandes, E. G.; Lombardi, A.; Solaro, R.; Chiellini, E. Thermal Characterization of Three-component Blends for Hot-Melt Adhesives. J. Appl. Polym. Sci. 2001, 80, 2889-2901.
57. Chronister, M. A. Heating Up. Adhes. Age 2001, 44, 34-38.
58. Chen, X. M.; Zhong, H.; Jia, L. Q.; Ning, J. C.; Tang, R. G.; Qiao, J. L.; Zhang, Z. Y. Polyesteramides Used for Hot Melt Adhesives: Synthesis and Effect of Inherent Viscosity on Properties. J. Appl. Polym. Sci. 2001, 82, 2867-2867.
59. Chen, X. M.; Zhong, H.; Jia, L. Q.; Ling, J. C.; Tang, R. G.; Qiao, J. L.; Zhang, Z. Y. Polyesteramides Used for Hot Melt Adhesives: Synthesis and Effect of Inherent Viscosity on Properties. J. Appl. Polym. Sci. 2001, 81, 2696-2701.
60. Barreueso-Martinez, B.; Ferrandiz-Gomez, T. D.; Martin-Martinez, J. M.; Aran-Ais, F.; Torro-Palau, A. M.; Orgiles-Barcelo, A. C. EVA Hot Melt Adhesives: Studying the Influence of Vinyl-acetate Content and Tackifier Nature. Adhes. Age 2001, 44, 32-37.
61. Khairullin, I. I.; Aleksashin, V. M.; Petrova, A. P. Use of Thermal Analysis Techniques for Studying a Hot-Melt Adhesive. Polym. Sci. Ser. 2007, 49, 84-88.
62. Good, D. J.; Mehaffy, J. A.; Haner, D. L. Hot Melt Adhesive. United States Patent 2005003197.
63. Abba, F.; Motel-Fourrier, C.; Sajot, N. E. Low Application Temperature Hot Melt Adhesive. United States Patent 2007088116.
64. Gong, L.; Narthana A. Triacetin Resistant Hot Melt Adhesive. United States Patent 2007031625.
65. Rye, J.; Mehaffy, J. A.; Duckworth, D. Integrated Low Application Temperature Hot Melt Adhesive Processing System. CA Patent 2561597.
66. Miller, S. R. Thermoplastic Melting Apparatus with a Level Indicator. United States Patent 2006182887.
67. Gong, L.; Allen, M. L.; Mehaffy, J. A.; Desai, D. R. Hot Melt Adhesive. United States Patent 2005042469.
68. Domine, J. D.; Joseph, J. M.; Pugh, S. Q. Hot Melt Adhesives. United States Patent 20021281.
69. Wang, B. Y. Polyolefin Based Hot Melt Adhesive Having Improved Heat Resistance. United States Patent 20070187032.
70. Mitchell, R. D. Raw Materials for Hot Melt Adhesives in the 21st Century. Adhes. Age 1999, 42, 24-27.
71. Paul, C. W.; Sharak, M. L.; Blumenthal, M. Green Adhesives. Adhes. Age 1999, 42, 34-39.
72. Viljanmaa, M.; Sodergard, A.; Tormala, P. Adhesion Properties of Lactic Acid Based Hot Melt Adhesives and Their Storage Stability in Different Packaging Applications. Int. J. Adhes. Adhes. 2002, 22, 447-457.
73. Slark, A.; Williams, N.; Toovey, G. Novel Reactive Hot Melt Adhesives. United States Patent 2004-810772.
74. Hu, Z.; Paul, C. W. Adhesives for Thermally Shrinkable Films or Labels. United States Patent 6649259.
75. Chen, X. M.; Zhong, H.; Jia, L. Q.; Ning, J. C.; Tang, R. G.; Qiao, J. L.; Zhang, Z. Y. Polyamides Derived from Piperazine and Used for Hot-melt Adhesives: Synthesis and Properties. Int. J. Adhes. Adhes. 2002, 22, 75-79.
76. Czeck, Z. Solvent Free Irradiation Cross-linkable Adhesives Based on Polyacrylates. Kautsch. Gummi Kunstst. 2002, 55, 492-498.
77. Mukherjee, G. S.; Shukla, N.; Singh, R. K.; Mathur, G. N. Thermoplastic Epoxide Resin in the Presence of Polyethylene Glycol as Hot-Melt Adhesive in Clean Technology. Def. Sci. J. 2004, 54, 249-255.
78. Kumar, R.; Choudhary, V.; Mishra, S.; Vanna, I. K. Enzymatically Modified Soy Protein: Part I. Thermal Behaviour. J. Therm. Anal. Calorim. 2004, 75, 727-738.
79. Kumar, R.; Choudhary, V.; Mishra, S.; Vanna, I. K. Enzymatically Modified Soy Protein Part 2: Adhesion Behaviour. J. Adhes. Sci. Technol. 2004, 18, 261-273.
80. Kumar, R.; Choudhary, V.; Mishra, S.; Vanna, I. K.; Mattiason, B. Adhesives and Plastics Based on Soy Protein Products. Ind. Crops Prod. 2002, 16, 155-172.
81. Miller, N.; Richard, A.; Gregg, A. Water-Dispersible Hot Melt Adhesive Formulations. Adhes. Age 1997, 40, 63-67.
82. Viljanmaa, M.; Sodergard, A.; Tormala, P. The Use of Lactic Acid-Based Hot Melt Adhesive in the Industrial Lamination Process. Int. J. Adhes. Adhes. 2003, 23, 151-154.
83. Broos, R.; Koopmans, R.; Rudolf, J.; Wevers, R. Polyester-amide Based Hot Melt Adhesives. United States Patent 200635201.
84. Lewis, D. N.; Schutte, G.; Westerhof, H. Environmentally Degradable Polymeric Compounds, Their Preparation and Use as Hot Melt Adhesive. EP Patent 1236753.
85. Schlademan, I. A. Co-vinyl Acetate-Based Hot Melt Adhesives. Hot Melt Symposium, Charlotte, NC, June 23-26, 2002; pp 116-121.
86. Lchihashi, H.; Hideki, Y. Hydrogel Adhesive. EP Patent 1321484.
87. Zhong, Z. K.; Sun, X. S.; Fang, X. H.; Ratto, J. A. Adhesive Strength of Guanidine Hydrochloride-Modifted Soy Protein for Fiberboard Application. Int. J. Adhes. Adhes. 2002, 22, 267-272.
88. Zhong, Z. K.; Sun, X. Z. S. Properties of Soy Protein Isolate/ Polycaprolactone Blends Compatibilized by Methylene Diphenyl Diisocyanate. Polymer 2001, 42, 6961-6969.
89. Guo, J.; Severtson, S. J.; Gwin, L. E. Optimizing the Monomer Composition of Acrylic Water-Based Pressure-Sensitive Adhesives to Minimize Their Impact on Recycling Operations. Ind. Eng. Chem. Res. 2007, 46, 2753-2759.
90. Nowak, M. J.; Severtson, S. J.; Wang, X. P.; Kroll, M. S. Properties Controlling the Impact of Styrenic Block Copolymer-Based Pressure Sensitive Adhesives on Paper Recycling. Ind. Eng. Chem. Res. 2003, 42, 1681-1687.
91. Severtson, S. J.; Wang, X. P.; Kroll, M. S. Development of Environmentally Benign Pressure-Sensitive Adhesive Systems via Modification of Substrate Properties. Ind. Eng. Chem. Res. 2002, 41, 5668-5675.