Adhesion and failure mechanisms of a model hot melt adhesive bonded to polypropylene

Journal of Adhesion

Volumn 61, Issue 1-4, 1997, Pages 1-25

  Tse, M F ^a   Hamed, G R ^b   Tathgur, A ^b  

^a EXXONMOBIL UPSTREAM RESEARCH COMPANY   (United States)

^b University of Akron   (United States)

Author keywords

Adhesion; Debonding frequency; Failure mechanism; Hot melt adhesive; Loss modulus; Loss tangent; Peel strength; Polypropylene; Rate temperature superposition; Storage modulus; Tackifier

Indexed keywords

ADHESION; BLOCK COPOLYMERS; BOND STRENGTH (MATERIALS); BONDING; CRYSTAL STRUCTURE; CRYSTALLINE MATERIALS; FAILURE ANALYSIS; PEELING; PLASTIC FILMS; POLYPROPYLENES; THERMAL EFFECTS; WAXES;

METHYL ACETATE COPOLYMERS; PEEL STRENGTH; T PEEL DEBONDING FREQUENCY; VINYL ACETATE COPOLYMERS;

HOT MELT ADHESIVES;

EID: 0030645591     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469708010513     Document Type: Article

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