Tack and fracture energy of tackified SIS (styrene-isoprene-styrene)-based hot-melt pressure sensitive adhesives (HMPSAs)

Journal of Adhesion Science and Technology

Volumn 20, Issue 12, 2006, Pages 1367-1381

  Kim, Dae Jun ^a,c   Kim, Wyun Joong ^a   Yoon, Goan Hee ^b  

^a Seoul National University   (South Korea)

^b VIXXOL A and C Corporation   (South Korea)

^c Samsung Electro Mechanics   (South Korea)

Author keywords

Fracture energy of blends; Hot melt pressure sensitive adhesives (HMP SAs); Miscibility; Phase diagram; Probe tack; SIS (styrene isoprene styrene); Tackifier

Indexed keywords

FRACTURE ENERGY OF BLENDS; HOT-MELT PRESSURE-SENSITIVE ADHESIVES (HMP-SA); PROBE TACKS; STYRENE-ISOPRENE-STYRENE (SIS); DIBLOCKS; HIGH-T; HOT MELT; PRESSURE-SENSITIVE ADHESIVES; STYRENE-ISOPRENE-STYRENE; TACKIFIERS;

FAILURE (MECHANICAL); FRACTURE; HOT MELT ADHESIVES; PHASE DIAGRAMS; PRESSURE EFFECTS; SOLUBILITY; ADHESIVES; FAILURE MODES; FRACTURE ENERGY; PROBES;

AROMATIC COMPOUNDS; STYRENE;

EID: 33750551084     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106778456618     Document Type: Article

References (15)

1. G. Gierenz and W. Karmann, Adhesives and Adhesive Tapes. Wiley-VCH, Weinheim (2001).
2. H. Mizumachi, Nitto Tech. Rep. 38 (2), 1-10 (2000).
3. Y. Y. Lin, C.-Y. Hui and H. D. Conway, J. Polym. Sci. Part B: Polym. Phys. 38, 2769-2784 (2000).
4. P. Tordjeman, E. Papon and J.-J. Villenave, J. Polym. Sci. Part B: Polym. Phys. 38, 1201-1208 (2000).
5. C. Creton and H. Lakrout, J. Polym. Sci. Part B: Polym. Phys. 38, 965-979 (2000).
6. C. Y. Hui, Y. Y. Lin and J. M. Baney, J. Polym. Sci. Part B: Polym. Phys. 38, 1485-1495 (2000).
7. K. J. Brown, C. Hooker and C. Creton, Macromol. Mater. Eng. 287, 163-179 (2002).
8. A. Zosel, in: Advances in Pressure Sensitive Adhesive Technology, D. Satas (Ed.), Vol. 3, pp. 92-127. Satas & Associates, Warwick, RI (1998).
9. H.-J. Kim and H. Mizumachi, J. Appl. Polym. Sci. 56, 201-209 (1995).
10. M. Fujita, M. Kajiyama, A. Takemura, H. Ono, H. Mizumachi and S. Hayashi, J. Appl. Polym. Sci. 70, 777-789 (1998).
11. T. Cardinal, S. Giordano, A. Riva and L. Viralini, in: Proc. 20th Pressure Sensitive Tape Council Annual Technical Seminar, Boston, MA, pp. 231-253 (1997).
12. F. C. Jagisch and J. M. Tancrede, in: Handbook of Pressure Sensitive Adhesives, D. Satas (Ed.), pp. 346-398. Satas & Associates, Warwick, RI (1999).
13. H.-J. Kim, S. Hayashi and H. Mizumachi, J. Appl. Polym. Sci. 69, 581-587 (1998).
14. H.-J. Kim and H. Mizumachi, in: Advances in Pressure Sensitive Adhesive Technology, D. Satas (Ed.), Vol. 3, pp. 77-128. Satas & Associates, Warwick, RI (1998).
15. I. Benedek and L. J. Heymans, Pressure Sensitive Adhesives Technology. Marcel Dekker, New York, NY (1996).