Optical path redirected multichannel waveguide connectors for surface mount technologies

IEEE Photonics Technology Letters

Volumn 16, Issue 10, 2004, Pages 2281-2283

  Hiramatsu, Seiki ^a   Kinosihta, Masao ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; LAMINATING; OPTICAL COMMUNICATION EQUIPMENT; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

FLIP CHIP BONDER; MULTICHANNEL INPUT-OUTPUTS; MULTICHANNEL WAVEGUIDE CONNECTORS; OPTICAL PATH REDIRECTION; THREE DIMENSIONAL WAVEGUIDE DEVICES; WAFER LEVEL STACK;

WAVEGUIDE COUPLERS;

EID: 5444239151     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2004.834528     Document Type: Article

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