Active inter poser (AIP) for chip level optical interconnections

European Conference on Optical Communication, ECOC

Volumn 2, Issue , 2002, Pages

  Hiramatsu, Seiki ^a   Kinoshita, Masao ^a   Hiruma, Kenji ^a   Ishizuka, Takeshi ^a   Okabe, Masahiro ^a   Furuyama, Hideto ^a   Mikawa, Takashi ^a   Ibaragi, Osamu ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT INTERCONNECTS; SURFACE MOUNT TECHNOLOGY;

CHIP-LEVEL; FLIP CHIP BONDING; OPTICAL SIGNALS;

OPTICAL COMMUNICATION;

EID: 84950280681     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. C. Rooman, et al., European Conference on Optical Communication, Amsterdam, The Netherlands, 2001, p296
2. David V. Plant, et al., J. Lighteave Technol., vol19, No.8, (2001)1093.
3. Yue Liu, Electronic Components and Technology Conf, Orland, Florida USA, 2001, p864.