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Japanese Journal of Applied Physics

Volumn 47, Issue 4 PART 2, 2008, Pages 2950-2953

Aluminum packaging for light-emitting diode using selectively anodizing method

(5) Kim, Kyoung Min a Lee, Young Ki b Shin, Sang Hyun b Choi, Seog Moon b Kwon, Young Se a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b Samsung Electro Mechanics (South Korea)

Author keywords

Aluminum anodizing; Aluminum packaging; Heat dissipation; LED packaging; Selective anodizing

Indexed keywords

ALUMINA; ALUMINUM; CHIP SCALE PACKAGES; ELECTRIC POWER UTILIZATION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; LIGHT EMISSION; LIGHT EMITTING DIODES; LIGHT METALS; REFLECTION; SEMICONDUCTOR JUNCTIONS;

ALUMINUM ANODIZING; ALUMINUM PACKAGING; HEAT DISSIPATION; LED PACKAGING; SELECTIVE ANODIZING;

PACKAGING;

EID: 54249130758 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.47.2950 Document Type: Article

Times cited : (7)

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