MEMS based metal plated silicon package for high power LED

Key Engineering Materials

Volumn 326-328 I, Issue , 2006, Pages 309-312

  Lee, Sung Jun ^a   Park, Ji Hyun ^a   Lim, Chang Hyun ^a   Jeong, Won Kyu ^a   Choi, Seog Moon ^a   Oh, Yong Soo ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

High power LED; MEMS; Thermal resistance

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC LOSSES; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; PLATING; SILICON;

ELECTRICAL INTERCONNECTIONS; POWER DISSIPATION; REFLECTOR CUPS; SILICON PACKAGE PLATFORMS;

LIGHT EMITTING DIODES;

EID: 33751529273     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-415-4.309     Document Type: Conference Paper

References (4)

1. Daniel A. Steigerwald, Jerome C. Bhat, Dave Collins, etc., IEEE Journal on Selected Topics in Quantum Electronics. Vol.8, No.2, pp. 310-320(2002)
2. Mehmet Arik, James Petroski and Stanton Weaver, 2002 Inter Society Conference on Thermal Phenomena, pp.113-120(2002)
3. thTHERMINIC Workshop, pp. 213-218(2003)
4. Marta Rencz, Future Circuits International, pp.51-52