SCOPUS 정보 검색 플랫폼

Japanese Journal of Applied Physics

Volumn 47, Issue 2 PART 1, 2008, Pages 1019-1021

Creep characteristics of clamped Cu membranes subjected to indentation

(4) Wang, Tong Hong a,b Fang, Te Hua c Kang, Shao Hui c Lin, Yu Cheng a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

c NATIONAL FORMOSA UNIVERSITY (Taiwan)

Author keywords

Creep; Cu membrane; Finite element analysis; Indentation; Von Mises stress

Indexed keywords

COPPER; CREEP; FINITE ELEMENT METHOD;

CREEP CHARACTERISTICS; CRITICAL LOADS; CU MEMBRANE; ELASTIC INDENTATIONS; FINITE ELEMENT ANALYSIS; FINITE-ELEMENT ANALYSES; INSTRUMENTED INDENTATIONS; LOW LOADS; MAXIMUM LOADS; NEGATIVE SLOPES; ROOM TEMPERATURES; VON MISES STRESS;

MEMBRANES;

EID: 54249097527 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.47.1019 Document Type: Article

Times cited : (6)

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