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Volumn 54, Issue 2, 2008, Pages 430-433
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Effect of electrode configuration and mode of deposition on magnetoresistance in electrodeposited Co/Cu multilayers on n-Si by a fully electrochemical method
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Author keywords
Composite pulse; Electrodeposition; Magnetoresistance; Metallic multilayers; Silicon
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Indexed keywords
COPPER;
ELECTRIC RESISTANCE;
ELECTROCHEMICAL ELECTRODES;
ELECTRODEPOSITION;
ELECTROLYSIS;
MAGNETIC FIELD EFFECTS;
MAGNETOELECTRONICS;
MAGNETORESISTANCE;
METALLIZING;
SILICON;
BACK CONTACTS;
CO/CU MULTILAYERS;
COMPOSITE PULSE;
CONTINUOUS MODE;
ELECTRO-CHEMICAL METHOD;
ELECTRODE CONFIGURATIONS;
ELECTROLESS PLATED;
METALLIC LAYERS;
METALLIC MULTILAYERS;
POTENTIOSTATIC PULSES;
PRODUCTION PROCESSES;
ROOM TEMPERATURES;
VAPOUR DEPOSITION;
MULTILAYERS;
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EID: 53649103359
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2008.07.065 Document Type: Article |
Times cited : (5)
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References (12)
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