Design advisor for package-on-package (PoP) manufacturing

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Bin, Xie ^a   Peng, Sun ^a   Daniel, Shi ^a  

^a HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INDUSTRIAL APPLICATIONS; INDUSTRIAL ENGINEERING; MACHINE DESIGN; NUMERICAL METHODS; PACKAGING MATERIALS; POLLUTION; PRODUCTION ENGINEERING; TECHNOLOGY; THREE DIMENSIONAL;

3-D PACKAGING; ASSEMBLY HOUSES; COMPLICATED SYSTEMS; CURING PROCESSES; DESIGN GUIDELINES; DESIGN-FOR MANUFACTURABILITY; ELECTRONIC PACKAGING; FINITE ELEMENT ANALYSIS; FORM FACTORS; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; KEY COMPONENTS; LOWER COST; MANUFACTURABILITY; MANUFACTURING COSTS; MANUFACTURING PROCESSES; MATE RIAL PROPERTIES; MULTI-LAYERED STRUCTURES; NUMERICAL MODELLING; PACKAGE DESIGNS; PACKAGE GEOMETRIES; PORTABLE PRODUCTS; PROCESS PARAMETERS; PROCESS SIMULATIONS; SIMULATION RESULTS; STAND-OFF HEIGHT; TIME-TO-MARKET; WARPAGE;

PROCESS ENGINEERING;

EID: 52449120954     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606950     Document Type: Conference Paper

References (13)

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