In-situ study of the effect of electromigration on strain evolution and mechanical property change in lead-free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1160-1163

  Ren, Fei ^a   Xu, Luhua ^b   Zhang, Xi ^a   Nah, Jae Woong ^a   Pang, John H L ^b   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANODE REGION; LEAD-FREE SOLDER JOINTS; MICRO-DISC TECHNOLOGY;

CURRENT DENSITY; ELASTIC MODULI; HARDNESS; SOLDERED JOINTS; STIFFNESS; STRAIN;

ELECTROMIGRATION;

EID: 33845578573     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645800     Document Type: Conference Paper

References (8)

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3. Ren, F. et al, "Effect of Electromigration on Mechanical Behavior of Solder Joints", Mater. Res. Soc. Symp. Proc. Vol.863, B10.2, 2005
4. Gan, H. et al, "Polarity Effect of Electromigration on Kinetics of Intermetallic Compound Formation in Pb-Free Solder V-Groove Samples", J. Appl. Phy. Vol.97, p063514(1-10), 2005
5. Ohta, H. et al, "Thermal Fatigue Mechanisms of CSP Solder Joints on PWB", NEC Res. & Develop., Vol.44, No.3, p246, 2003
6. Chang, C.M. et al, "Mechanical Strength of Sn-3.5Ag-Based Solder and Related Bondings", JEM, Vol.33, No.1, 2004
7. McCabe, R. J. et al, " The Creep Properties of Precipitation Strengthened Tin-Based Alloys", JOM, p33, 2003
8. Li, X.D. et al, "A Review of Nanoindentation Continuous Stiffness measurement Technique and Its Applications", Mater. Charac., Vol.48, p11-36, 2002