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Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 131-138

Fine pitch (150μm) Pb-free flip chip bumping & packaging

(7) Nicholls, Lou a Darveaux, Robert a Hansen, Bernt b Carey, Chuck b Aoki, Toyohiro c Akimoto, Toshiharu c Chang, Jason d

a AMKOR TECHNOLOGY (United States)

b IBM (United States)

c IBM JAPAN LTD (Japan)

d Unitive Semiconductor Taiwan Ltd (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUMP SIZE; FLIP CHIP BUMPING; TEST VEHICLES;

CHIP SCALE PACKAGES; INTEGRATED CIRCUIT LAYOUT; LAMINATES; LEAD; TECHNOLOGY TRANSFER;

FLIP CHIP DEVICES;

EID: 33845563115 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2006.1645636 Document Type: Conference Paper

Times cited : (10)

References (11)

1
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- (2004) Proc 2004 Pan Pacific Microelectronics Symposium , pp. 29-32
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2
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- Qualification of low-K 90ηm technology die with Pb-free bumps on a build-up laminate package (PBGA) with Pb-free assembly processes
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3
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4
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- Assembly process and package design for high performance flip chip
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- J. Aday, D. Brady, and D. McCann, "Assembly Process and Package Design for High Performance Flip Chip," Proc 2004 SMTA International Conf, Chicago, IL, Sep. 2004, pp. 345-350.
- (2004) Proc 2004 SMTA International Conf , pp. 345-350
- Aday, J.¹ Brady, D.² McCann, D.³

5
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- Unitive plated Pb-free solder solutions
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- (2003) Proc Peaks in Packaging Wafer Level Package Symposium
- Mis, D.¹

6
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- Reliability of plastic ball grid array assembly
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- R. Darveaux, K. Banerji, A. Mawyer, and G. Dody, "Reliability of Plastic Ball Grid Array Assembly," Ball Grid Array Technology. J.Lau, Editor, McGraw-Hill, Inc., New York, 1995.
- (1995) Ball Grid Array Technology
- Darveaux, R.¹ Banerji, K.² Mawyer, A.³ Dody, G.⁴

7
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- Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
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8
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9
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- Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction
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- R. Darveaux, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction," Journal of Electronic Packaging, Vol 124, September 2002, pp. 147-154.
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10
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- Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag-Cu assemblies
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- Clech, J.-P.¹

11
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- Tensile deformation of WLCSP and flip chip solder joints
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- (2005) Proc MAPS Topical Workshop and Exhibition on Flip Chip Technologies
- Darveaux, R.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.