Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 385-388

  Decharat, Adit ^a   Boers, Marc ^a   Niklaus, Frank ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPOSITE MICROMECHANICS; EXPERIMENTS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; REACTIVE ION ETCHING; WELDING;

BONDING PROCESSES; COLD METAL; INTERNATIONAL CONFERENCES; METAL RINGS; METAL SEALING; METAL-TO-METAL BONDING; MICRO-CAVITIES; MICRO-ELECTRO MECHANICAL SYSTEMS; ROOM TEMPERATURE BONDING; ROOM TEMPERATURES; SEALING RINGS; WAFER LEVELS;

WAFER BONDING;

EID: 52149092524     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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