Micro-brush press-on contact: A new technique for room temperature electrical and mechanical attachment

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn 2006, Issue , 2006, Pages 342-345

  Lee, Sang Hyun ^a   Chae, Junseok ^a   Yazdi, Navid ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIES; ELECTRIC CONTACTS; SILICON WAFERS; SOLDERING ALLOYS;

ELECTRICAL ATTACHMENT; ELECTRICAL INTERCONNECTIONS; MECHANICAL CONTACTS;

MICROELECTROMECHANICAL DEVICES;

EID: 33750110018     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. H. Han, L. E. Weiss, and M. L. Reed, "Mating and Piercing Micromechanical Structures for Surface Bonding Application," in Proc. IEEE MEMS'91, Nara, Japan, Jan. 30-Feb.2, 253 (1991).
2. H. Han, L. E. Weiss, M. L. Reed, " Micromechanical Velcro," Journal of Microelectromechanical Systems, 1, 37 (1992).
3. C. C. Lee, C. Y. Wang, and G. Matijasevic, "Au-In Bonding Below the Eutectic Temperature," IEEE Transactions on Components, Hybrid, and Manufacturing Technology, 16, 311 (1993).
4. S. -H. Lee, J. Chae, S. Yoon, N. Yazdi, and K. Najafi, "Low-Power Thermal Isolation for Environmentally Resistant Microinstruments," Proc. IEEE MEMS'05, Miami, USA, Jan.30-Feb.3, 532 (2005).