Tribological properties of graded diamond-like carbon films on Ti ion-implanted aluminum substrate

Diamond and Related Materials

Volumn 17, Issue 11, 2008, Pages 1844-1849

  Xu, Ming ^a,b   Cai, Xun ^a   Liu, Youming ^a,b   Pu, Shihao ^b,c   Chu, Paul K ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c SOUTHWESTERN INSTITUTE OF PHYSICS   (China)

Author keywords

Al substrate; Diamond like carbon; Graded films; Scratch; Ti pre implantation

Indexed keywords

ALUMINA; ALUMINUM; CARBON FILMS; DIAMOND LIKE CARBON FILMS; DIAMONDS; ELECTRIC LOAD MANAGEMENT; FRICTION; LIGHT METALS; MAGNETRON SPUTTERING; MOLECULAR BEAM EPITAXY; SPUTTER DEPOSITION; SUBSTRATES; TITANIUM;

AL SUBSTRATE; ALUMINUM SUBSTRATES; DIAMOND-LIKE CARBON; DLC FILMS; FRICTION CO-EFFICIENT; FUNCTIONALLY GRADED; GRADED FILMS; SCRATCH; TI PRE-IMPLANTATION; TITANIUM IONS; TRIBOLOGICAL PROPERTIES;

DIAMOND FILMS;

EID: 52049089922     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2007.12.025     Document Type: Article

References (17)

1. Dotto M.E.R., Martins R.N., Ferreira M., and Camargo Jr. S.S. Surf. Coat. Technol. 200 (2006) 6479
2. Robertson J. Mat. Sci. Engin. Reports 37 (2002) 129
3. Liu X.Y., Chu P.K., and Ding C.X. Mat. Sci. Engin. Reports 47 (2004) 49
4. Poon R.W.Y., Yeung K.W.K., Liu X.Y., Chu P.K., Chung C.Y., Lu W.W., Cheung K.M.C., and Chan D. Biomat 26 (2005) 2265
5. Kwok S.C.H., Wang J., and Chu P.K. Diamond Relat. Mater. 14 (2005) 78
6. Ravi N., Bukhovets V.L., Varshavskaya I.G., and Sundararajan G. Diamond Relat. Mater. 16 (2007) 90
7. Lyubimov V.V., Voevodin A.A., Spassky S.E., and Yerokhin A.L. Thin Solid Films 207 (1992) 117
8. Lee K.R., Baik Y.J., Eun K., and Han S. Diamond Relat. Mater. 3 (1994) 1230
9. Lee K.R., Eun K., and Rhee J.S. Mater. Res. Soc. Symp. Proc. 356 (1995) 233
10. Choy K.L., and Felix E. Mat. Sci. Engi. A 278 (2000) 162
11. Voevodin A.A., Schneider J.M., Rebholz C., and Matthews A. Tribol. Int. 29 (1996) 559
12. Zeng Z.M., Zhang T., Tian X.B., Tang B.Y., Kwok T.K., and Chu P.K. Surf. Coat. Technol. 128-129 (2000) 236
13. Chu P.K., Qin S., Chan C., Cheung N.W., and Larson L.A. Mat. Sci. Engin. Reports 17 6-7 (1996) 207
14. Chu P.K., Tang B.Y., Wang L.P., Wang X.F., Wang S.Y., and Huang N. Rev. Sci. Instrum. 72 3 (2001) 1660
15. Knight S.T., Evans P.J., and Samandi M. Nucl. Instrum. Methods Phys. Res., B Beam Interact. Mater. Atoms 119 (1996) 501
16. Jawarani D., Stark J.P., Kawasaki H., Olwolafe J.O., Lee C.C., Klein J., and Pintchovski F. J. Electrochem. Soc. 141 (1994) 302
17. Xu M., Liu Y.M., Li L.H., Cai X., Chen Q.L., and Chu P.K. J. Vac. Sci. Technol. A 24 (2006) 212