Enhanced thermal dissipation and light output of GaN/Sapphire light-emitting diodes by direct Cu electroplating

ECS Transactions

Volumn 13, Issue 3, 2008, Pages 13-18

  Chiang, C C ^a   Horng, R H ^a   Wuu, D S ^a   Hsiao, H Y ^a   Hsieh, C Y ^a   Lin, H I ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b Liung Feng Industrial Co Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU ELECTROPLATING; CU SUBSTRATES; CURRENT DRIVINGS; GAN/SAPPHIRE; HEAT SPREADERS; LIGHT EMITTING DIODE LEDS; LIGHT OUTPUTS; OUTPUT POWERS;

BLOOD VESSEL PROSTHESES; CONVERSION EFFICIENCY; COPPER; CORUNDUM; CRYSTALS; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; GALLIUM NITRIDE; HEATING EQUIPMENT; LIGHT EMISSION; LITHOGRAPHY; SEMICONDUCTING GALLIUM; SEMICONDUCTING ZINC COMPOUNDS; SEMICONDUCTOR DIODES; SEMICONDUCTOR MATERIALS; SPREADERS; THERMAL CONDUCTIVITY; ZINC ALLOYS; ZINC OXIDE;

LIGHT EMITTING DIODES;

EID: 51849101674     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2913076     Document Type: Conference Paper

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