Wettability of lead-free solders of Sn-Zn-xAl

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 8, 2008, Pages

  Chen, Wenxue ^a   Xue, Songbai ^a   Wang, Hui ^a   Hu, Yuhua ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Al; Lead free solder; Nitrogen; Sn Zn; Wettability

Indexed keywords

BRAZING; LEAD; WELDING; ZINC;

AL; LEAD-FREE SOLDER; NITROGEN; SN-ZN; WETTABILITY;

TIN;

EID: 51649090176     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Anderson I E, Foley J C, Cook B A, et al. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability[J]. Journal of Electronic Materials, 2001, 30: 1050-1059.
2. Villain I, Jillek W, Schmitt E, et al. Properties and reliability of Sn-Zn-based lead-Free solder alloys[C]//2004 International IEEE Conference on Asian Green Electronics. Hong Kong, China, IEEE, 2004, 11-19.
3. Abtewa M, Selvaduray G. Lead-free solders in microelectronics[J]. Materials Science and Engineering R, 2000, 27(1): 95-141.
4. Lin K L, Liu T P. High-temperature oxidation of a Sn-Zn-Al solder[J]. Oxidation of Metals, 1998, 50(3-4): 255-267.