-
1
-
-
33746626966
-
Design space exploration for 3D architectures
-
Y. Xie, G. H. Loh, B. Black, and K. Bernstein, "Design space exploration for 3D architectures," J. Emerg. Technol. Comput. Syst., vol. 2, no. 2, pp. 65-103, 2006.
-
(2006)
J. Emerg. Technol. Comput. Syst
, vol.2
, Issue.2
, pp. 65-103
-
-
Xie, Y.1
Loh, G.H.2
Black, B.3
Bernstein, K.4
-
2
-
-
33847743417
-
A novel nonvolatile memory with spin torque transfer magnetization switching: Spin-ram
-
M. Hosomi, H. Yamagishi, and T. Yamamoto, "A novel nonvolatile memory with spin torque transfer magnetization switching: spin-ram," in International Electron Devices Meeting, 2005, pp. 459-462.
-
(2005)
International Electron Devices Meeting
, pp. 459-462
-
-
Hosomi, M.1
Yamagishi, H.2
Yamamoto, T.3
-
3
-
-
34247864561
-
2Mb Spin-Transfer Torque RAM (SPRAM) with Bit-by-Bit Bidirectional Current Write and Parallelizing- Direction Current Read
-
T. Kawahara, R. Takemura, and K. Miura, "2Mb Spin-Transfer Torque RAM (SPRAM) with Bit-by-Bit Bidirectional Current Write and Parallelizing- Direction Current Read," in IEEE International Solid-State Circuits Conference, 2007, pp. 480-617.
-
(2007)
IEEE International Solid-State Circuits Conference
, pp. 480-617
-
-
Kawahara, T.1
Takemura, R.2
Miura, K.3
-
4
-
-
43549121995
-
Macro-model of Spin-Transfer Torque based Magnetic Tunnel Junction device for hybrid Magnetic-CMOS design
-
W. Zhao, E. Belhaire, and Q. Mistral, "Macro-model of Spin-Transfer Torque based Magnetic Tunnel Junction device for hybrid Magnetic-CMOS design," in IEEE International Behavioral Modeling and Simulation Workshop, 2006, pp. 40-43.
-
(2006)
IEEE International Behavioral Modeling and Simulation Workshop
, pp. 40-43
-
-
Zhao, W.1
Belhaire, E.2
Mistral, Q.3
-
5
-
-
40349090128
-
Die Stacking (3D) Microarchitecture
-
B. Bryan, A. Murali, and B. Ned, "Die Stacking (3D) Microarchitecture," in International Symposium on Microarchitecture, 2006, pp. 469-479.
-
(2006)
International Symposium on Microarchitecture
, pp. 469-479
-
-
Bryan, B.1
Murali, A.2
Ned, B.3
-
6
-
-
34547204691
-
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
-
G. L. Loi, B. Agrawal, and N. Srivastava, "A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy," in Design Automation Conference, 2006, pp. 991-996.
-
(2006)
Design Automation Conference
, pp. 991-996
-
-
Loi, G.L.1
Agrawal, B.2
Srivastava, N.3
-
7
-
-
9344233646
-
On-chip MRAM as a high-bandwidth low-latency replacement for DRAM physical memories,
-
Tech. Rep
-
R. Desikan, C. R. Lefurgy, S. W. Keckler, and D. Burger, "On-chip MRAM as a high-bandwidth low-latency replacement for DRAM physical memories," Tech. Rep., 2002.
-
(2002)
-
-
Desikan, R.1
Lefurgy, C.R.2
Keckler, S.W.3
Burger, D.4
-
8
-
-
51549107827
-
Assessment of MRAM technology characteristics and architectures,
-
Tech. Rep
-
R. Desikan, S. Keckler, and D. Burger, "Assessment of MRAM technology characteristics and architectures," Tech. Rep., 2002.
-
(2002)
-
-
Desikan, R.1
Keckler, S.2
Burger, D.3
-
11
-
-
51549089469
-
Spin Injection MRAM main focus at MMM,
-
Tech. Rep
-
M. Oishi, "Spin Injection MRAM main focus at MMM," Tech. Rep., 2007.
-
(2007)
-
-
Oishi, M.1
-
12
-
-
33845878310
-
Alpha ev7 processor: A high-performance tradition continues,
-
K. Krewel, "Alpha ev7 processor: A high-performance tradition continues," Microprocessor Report, 2005.
-
(2005)
Microprocessor Report
-
-
Krewel, K.1
-
13
-
-
51549104564
-
-
D. C. Burger and T. M. Austin, Simplescalar tool set, version 2.0, in Computer Architecture News, 1997
-
D. C. Burger and T. M. Austin, "Simplescalar tool set, version 2.0," in Computer Architecture News, 1997.
-
-
-
-
14
-
-
28344453642
-
Bridging the processor-memory performance gap with 3d ic technology
-
C. Liu, I. Ganusov, M. Burtscher, and S. Tiwari, "Bridging the processor-memory performance gap with 3d ic technology," IEEE Design and Test of Computers, vol. 22, no. 6, pp. 556-564, 2005.
-
(2005)
IEEE Design and Test of Computers
, vol.22
, Issue.6
, pp. 556-564
-
-
Liu, C.1
Ganusov, I.2
Burtscher, M.3
Tiwari, S.4
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