Modeling China's semiconductor industry fluorinated compound emissions and drafting a roadmap for climate protection

International Journal of Greenhouse Gas Control

Volumn 2, Issue 4, 2008, Pages 665-676

  Bartos, Scott C ^a   Kshetry, Nina ^b   Burton, C Shepherd ^c  

^a U S ENVIRONMENTAL PROTECTION AGENCY   (United States)

^b ICF INTERNATIONAL   (United States)

^c NONE   (United States)

Author keywords

China; Climate change; Fluorinated compounds; Global warming; Greenhouse gas; Semiconductors; World Semiconductor Council

Indexed keywords

CLIMATE CHANGE; EMISSION CONTROL; ENVIRONMENTAL PROTECTION AGENCY; GLOBAL WARMING; GREENHOUSE GASES; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS;

CHINA; CHINESE MANUFACTURERS; CLIMATE PROTECTION; EMISSION REDUCTION; FLUORINATED COMPOUND; GLOBAL WARMING POTENTIAL; SEMICONDUCTOR INDUSTRY; WORLD SEMICONDUCTOR COUNCIL;

SEMICONDUCTING SILICON;

BASELINE CONDITIONS; CLIMATE CHANGE; EMISSION CONTROL; ENVIRONMENTAL PROTECTION; GREENHOUSE GAS; INDUSTRIAL EMISSION; MODELING; SEMICONDUCTOR INDUSTRY;

ASIA; CHINA; EURASIA; FAR EAST;

EID: 51449097953     PISSN: 17505836     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijggc.2008.02.010     Document Type: Article

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