Characterization and comparison of five SAC-based solder pastes for Pb-free reflow soldering

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Chen, Catherine H ^a   Wong, Wallace ^a   Lo, Jeffery C C ^a   Song, Fubin ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; MELTING POINT; PARAMETER ESTIMATION; SOLDERING ALLOYS;

SOLDER PASTES; SOLDER REFLOWS;

SOLDERING;

EID: 41049096221     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283549     Document Type: Conference Paper

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