Low temperature carbon nanotube film transfer via conductive adhesives

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 463-466

  Jiang, Hongjin ^a   Zhu, Lingbo ^a   Moon, Kyoung Sik ^a   Li, Yi ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVES; FILM TRANSFER; HIGH RESISTIVITY ADHESIVES;

ADHESIVES; CARBON FILMS; LOW TEMPERATURE EFFECTS; MORPHOLOGY; OHMIC CONTACTS; SILICON WAFERS;

CARBON NANOTUBES;

EID: 35348853137     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373838     Document Type: Conference Paper

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