Warpage analysis of epoxy molded packages using viscoelastic based model

Journal of Materials Science

Volumn 41, Issue 12, 2006, Pages 3773-3780

  Srikanth, Narasimalu ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; INTEGRATED CIRCUITS; PACKAGING; PLASTICS; SHEET MOLDING COMPOUNDS; VISCOELASTICITY;

EPOXY MOLDED PACKAGES; EPOXY MOLDING COMPOUNDS; PLASTIC INTEGRATED CIRCUIT (IC) PACKAGING; VISCOELASTIC BASED MATERIAL MODEL;

MATERIALS SCIENCE;

EPOXIDES; MOLDING; WARPAGE;

EID: 33746052919     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-2373-9     Document Type: Article

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