An ultra high performance 1Tbps bandwidth optoelectronic LSI package using post-reflow optical-interface stacking technique

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 87-93

  Hamasaki, Hiroshi ^a   Furuyama, Hideto ^a   Uemura, Hiroshi ^a   Numata, Hideo ^a   Takubo, Chiaki ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

FR 4; Optical interconnection; Optoelectronics; POST LSI package; Solder reflow

Indexed keywords

FR-4; INTERCONNECTION DENSITY; LSI PACKAGE; MULTIMODE OPTICAL FIBERS; OPTOELECTRONIC PACKAGES; SOLDER REFLOW; TRANSMISSION CHARACTERISTICS; ULTRA HIGH PERFORMANCE;

BANDWIDTH; MICROELECTRONICS; OPTICAL FIBERS; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES;

ELECTRIC CONTACTS;

EID: 51349126856     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. D. Pham, S. Asano, M. Bolliger, M. N. Day, H. P. Hofstee, C. Johns, J. Kahle, A. Kameyama, J. Keaty, Y. Masubuchi, M. Riley, D. Shippy, D. Stasiak, M. Suzuoki, M. Wang, J. Warnock, S. Weitzel, D. Wendel, T. Yamazaki, K. Yazawa, "The Design and Implementation of a First-Generation CELL Processor", ISSCC Dig. Tech. Papers, Paper 10.2, pp.184-186, Feb., 2005.
2. H. Hamasaki, H. Furuyama, H. Numata and C. Takubo, "Novel Optoelectronic LSI Packaging Suitable for Standard FR-4 Printed Wiring Board with Bandwidth Capability of Over 1Tbps", proceedings of the 56rd ECTC, pp.298-302, 2006.
3. T. Mikawa, H. Furuyama, S. Hiramatsu, M. Kinoshita and O. Ibaragi, "Over 10 Gbps/ch Compact Active Interposer Module for High-speed and High-density Chip Level Optical Interconnects", the 16th IEEE/LEOS Annual Meeting Conference, vol.1, pp.368-9, 2003.
4. F. E. Doany, C. L. Schow, C. Baks, R. Budd, Y. J. Chang, P. Pepeljugoski, L. Schares, D. Kuchta, R. John, J A. Kash, F. Libsch, "160-Gb/s Bidirectional Parallel optical Transceiver Module for Board-Level Interconnects Using a Single-Chip CMOSIC", proceedings of the 57rd ECTC, pp.1256-1261, 2007.
5. K. Kurata, I. Hatakeyama, K. Miyoshi, T. Shimizu, J. Sasaki, M. Kurihara and K. Yamamoto, "Opto-Electronics Packaging Techniques for Interconnection", the 16th IEEE/LEOS Annual Meeting Conference, vol.1, pp.364-5, 2003.
6. F. Shimizu, H. Furuyama, H. Hamasaki, F. Kuroda, M. Nakamura and T. Tamura, "Optical Parallel Interconnection Characteristics of 4-Channel 2-Gbit/s Bit Synchronous Data Transmission Module", proceedings of the 42nd ECTC, pp.77-82, 1992.