Novel optoelectronic LSI packaging suitable for standard FR-4 printed wiring board with bandwidth capability of over 1Tbps

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 298-302

  Hamasaki, Hiroshi ^a   Furuyama, Hideto ^a   Numata, Hideo ^a   Takubo, Chiaki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CHIP SCALE PACKAGES; COST EFFECTIVENESS; INTEGRATED OPTOELECTRONICS; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS;

ELECTRICAL CONTACTS; INTERFACE MODULES; OPTICAL INTERFACES; SOLDER REFLOW PROCESS;

LSI CIRCUITS;

EID: 33845571096     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645662     Document Type: Conference Paper

References (5)

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2. K. Kurata, I. Hatakeyama, K. Miyoshi, T. Shimizu, J. Sasaki, M. Kurihara and K. Yamamoto, "Opto-Electronics Packaging Techniques for Interconnection", the 16th IEEE/LEOS Annual Meeting Conference, vol.1, pp.364-5, 2003.
3. T. Mikawa, H. Furuyama, S. Hiramatsu, M. Kinoshita and O. Ibaragi, "Over 10 Gbps/ch Compact Active Interposer Module for High-speed and High-density Chip Level Optical Interconnects", the 16th IEEE/LEOS Annual Meeting Conference, vol.1, pp.368-9, 2003.
4. F. Shimizu, H. Furuyama, H. Hamasaki, F. Kuroda, M. Nakamura and T. Tamura, "Optical parallel interconnection characteristics of 4-channel 2-Gbit/s bit synchronous data transmission module", proceedings of the 42nd ECTC, pp.77-82, 1992.
5. Y. Ishii, T. Hyashi and H. takahara, "Demonstration of onPCB optical interconnection using surface-mount and polymer waveguide", proceedings of the 53rd ECTC, pp. 1147-52, 2003.