Forming high temperature solder interfaces by low temperature fluxless processing

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 729-734

  Lu, Daoqiang Daniel ^a   Hu, Chuan ^a   Huang, Annie Tzu Yu ^b  

^a INTEL CORPORATION   (United States)

^b Engineering IV   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUXLESS PROCESSING; LAYERED STRUCTURES; SOLDER INTERFACES;

ANNEALING; DIFFERENTIAL SCANNING CALORIMETRY; HIGH TEMPERATURE OPERATIONS; MELTING POINT; SOLDERED JOINTS; SOLDERING ALLOYS;

ELECTRONICS PACKAGING;

EID: 40449133140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33197     Document Type: Conference Paper

References (11)